Immersion Corrosion of Sn-Ag and Sn-Bi Alloys as Successors to Sn-Pb Alloy with Electronic and Jewelry Applications

Satizabal, Luz M.; Poloni, Erik; Bortolozo, Ausdinir D.; Osório, Wislei R.

doi:10.5006/2039

Cited by 11 publications

(3 citation statements)

References 39 publications

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“…The electrolyte layer therefore would be formed on the surface of the alloy when the metal contacts and adsorbs smoke components, and this can provide a place for electrochemical corrosion. Besides, the chloride ion could facilitate the corrosion of the metal due to its promotion effect on the metal ionization process …”

Section: Resultsmentioning

confidence: 99%

Corrosion behavior of Sn‐3.0Ag‐0.5Cu solder under different fire smoke atmospheres generated by burning polyvinyl chloride and polyethylene

Liu

et al. 2017

Materials & Corrosion

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The corrosion characteristics of Sn‐3.0Ag‐0.5Cu solder under polyvinyl chloride (PVC) and polyethylene (PE) fire smoke atmospheres were investigated by weight loss method and surface characterization techniques. The corrosion kinetics results of 15‐day tests show that the mass loss of Sn‐3.0Ag‐0.5Cu solder in PE smoke is much lower than that in PVC smoke. The former shows no significant variation during the test. In contrast, the latter increases rapidly first and then presents a slow exponential increase. Microstructure analysis indicates that no obvious corrosion product appeared in PE smoke. Nevertheless, the corrosion products in PVC smoke grow larger first and then become smaller and denser. The possible growth process of corrosion products is that grain growth dominates the formation of the corrosion products at the initial stage and then the nucleation process is predominant. Furthermore, the corrosion mechanisms of Sn‐3.0Ag‐0.5Cu solder in the different fire smoke are also analyzed. Stannous oxide and stannic oxide are regarded as the corrosion products under both PE and PVC smoke atmospheres, while Sn21Cl16(OH)14O6 is only observed under PVC smoke atmosphere.

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Section: Resultsmentioning

confidence: 99%

Corrosion behavior of Sn‐3.0Ag‐0.5Cu solder under different fire smoke atmospheres generated by burning polyvinyl chloride and polyethylene

Liu

et al. 2017

Materials & Corrosion

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“…The corrosion rate, CR (mm/y), was calculated according to the equation given below [ 22 ] :

normalC normalR = \frac{(m_{0} - m_{i} + m_{b 0} - m_{b 1}) \times 87600}{s \times t \times ρ} .

…”

Section: Methodsmentioning

confidence: 99%

Effect of relative humidity on the corrosion behavior of Sn–0.7Cu solder under polyvinyl chloride fire smoke atmosphere

Lin

et al. 2020

Materials & Corrosion

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The effect of environment relative humidity (RH) on the corrosion behavior of Sn-0.7Cu solder was investigated by the weight loss method and surface characterization techniques. In this study, RH ranging from 50% to 98% was researched. The results show that the corrosion degree is getting worse from 50% RH to 90% RH. However, the corrosion rate at 98% RH is lower than that at 90% RH, which may be ascribed to the degree of oxygen diffusion in electrolyte layers of different thicknesses. The microstructure characterization proved that the corrosion products exhibit a superimposed growth and present the same corrosion degree variation trend as the corrosion kinetics. The compositions of corrosion products are examined, and Sn 21 Cl 16 (OH) 14 O 6 , SnO, and SnO 2 are the main corrosion products.

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“…While mechanical and physical properties of these new alloys are always evaluated, the same cannot be said for their corrosion behaviour. Although numerous attempts have been conducted to investigate the corrosion behaviour of lead-free solder alloys [29][30][31][32][33][34][35][36][37][38], there is still little information regarding the galvanic corrosion of solder alloys in contact to Cu or Ni substrates; in fact, only a few studies have been reported to date [39,40].…”

Section: Introductionmentioning

confidence: 99%

Galvanic corrosion analysis of a Bi–Zn solder alloy coupled to Ni and Cu substrates

Septimio

Arenas

Conde

et al. 2020

Corrosion Engineering, Science and Technology

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Corrosion has become a frequent and significant issue in the electronics industry. For this reason, galvanic corrosion of soldered joints, i.e. when solder alloys are in contact with a metallic substrate, is so important. The present study aims to investigate the corrosion behaviour of the Bi-2.7wt-%Zn solder alloy when in contact with Cu and Ni substrates in a 0.06M NaCl solution. Polarisation curves show that Ni and Cu have nobler behaviour than the Bi-Zn alloy. However, although the Bi-Zn alloy exhibits active corrosion behaviour, the open circuit potential tends to shift toward more positive potentials over time. The galvanic current densities (i galv ) of both Bi-Zn alloy/Ni and Cu couples are initially similar and three times higher than the corrosion current density of the Bi-Zn alloy. However, the couples show a decrease in i galv. , with time and the couple formed with Ni has produced the lowest galvanic current density.

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Immersion Corrosion of Sn-Ag and Sn-Bi Alloys as Successors to Sn-Pb Alloy with Electronic and Jewelry Applications

Cited by 11 publications

References 39 publications

Corrosion behavior of Sn‐3.0Ag‐0.5Cu solder under different fire smoke atmospheres generated by burning polyvinyl chloride and polyethylene

Corrosion behavior of Sn‐3.0Ag‐0.5Cu solder under different fire smoke atmospheres generated by burning polyvinyl chloride and polyethylene

Effect of relative humidity on the corrosion behavior of Sn–0.7Cu solder under polyvinyl chloride fire smoke atmosphere

Galvanic corrosion analysis of a Bi–Zn solder alloy coupled to Ni and Cu substrates

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