Immersion tin: Its chemistry, metallurgy, and application in electronic packaging technology

Kovac, Z.; Tu, King‐Ning

doi:10.1147/rd.286.0726

Cited by 12 publications

(3 citation statements)

References 8 publications

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“…The presence of a complexing agent, thiourea, alters the chemical activity of the metals, tin and copper, in the solution, and thus enables tin to be deposited onto the copper surface by displacing copper. 19,20 Water rinses follow each of the steps described above, with the exception of the predip. Following the tin bath, a drying process removes any residual moisture from the board to prevent staining and ensure high metal quality.…”

Section: Lead-free Surface Finishesmentioning

confidence: 99%

An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics

Wang

Choubey

Azarian

et al. 2009

Journal of Elec Materi

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The worldwide transition to lead-free electronics has increased the usage of several lead-free pad finishes for electronic assembly manufacturers, including immersion silver, immersion tin, electroless nickel-immersion gold, and organic solderability preservatives. This study assesses and compares immersion silver as a circuit board finish in terms of its ease of use, wettability, solderability, shelf life, appearance, solder joint strength, intermetallic and void formation, reliability, and costs.

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Section: Lead-free Surface Finishesmentioning

confidence: 99%

An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics

Wang

Choubey

Azarian

et al. 2009

Journal of Elec Materi

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“…Reflow soldering was performed on FR4 standard substrates without solder resist, with Cu pads (approximately 1.5 mm²) and a protective tin layer (>99 wt.% Sn) of varying thickness, which was applied by Hot Air Solder Leveling (thick layers) or by immersion deposition of tin (thin layers) [8]. Furthermore, an inert glass surface was used as substrate.…”

Section: Methodsmentioning

confidence: 99%

Void formation on PCB surface finish during reflow soldering

Ewald

Holle

Wolter

2011

Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE)

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Printed circuit board (PCB) surface finish and its reactive wetting process were identified as a main cause of voiding. During reflow soldering liquid flux residues adhered to the interface PCB / liquid solder alloy form voids while the solder alloy is in a liquid state. In contrast to that no voids are found when no reactive wetting occurred. Furthermore, we observed that the number of detected voids after the reflow process strongly depends on the tin layer thickness: Many voids are formed in the case of a thin tin layer, no voids are found in the case of a very thick tin layer. A model is established to explain this phenomenon.

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“…3 The growth rate is found to be governed by diffusion-controlled kinetics in tin deposition. 8 Higher temperature is more favorable to the coating growth, but a too-high bath temperature is not proper for the tin deposition in the practice.…”

Section: Reduction Process In Immersion Tin Reaction-effect Of Immers...mentioning

confidence: 99%

Study on Immersion Tin Process by Electrochemical Methods and Molecular Orbital Theory

Zhao

Cui

et al. 2006

J. Electrochem. Soc.

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Electroless deposition of tin onto copper surface has been studied by means of electrochemistry, X-ray fluorescence spectrometry, and theoretical Hartree-Fock methods. There are two processes in series involved in the hypophosphite-type immersion tin reaction, based on the analysis of the immersion tin potential curves and the structure of the deposits. The first displacement process is significantly affected by the complexing agents of cuprous and the concentration of SnSO 4 , mainly due to the formation of Cu-Sn alloy and a thinner tin layer. The second process is attributed to the stannous ion reduction by hypophosphite at higher temperatures.

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Immersion tin: Its chemistry, metallurgy, and application in electronic packaging technology

Cited by 12 publications

References 8 publications

An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics

An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics

Void formation on PCB surface finish during reflow soldering

Study on Immersion Tin Process by Electrochemical Methods and Molecular Orbital Theory

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