Impact of Copper Through-Package Vias on Thermal Performance of Glass Interposers

Cho, Sangbeom; Tummala, Rao; Joshi, Yogendra

doi:10.1109/tcpmt.2015.2450731

Cited by 30 publications

(5 citation statements)

References 19 publications

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“…[4][5][6][7][8] Vias through the glass are needed to connect top and bottom surfaces, and it is advantageous for these vias to be filled with Cu, first so that the surfaces may be planarized for further buildup and/or component attachment, 5,9,10 and second to increase thermal transport through the interposer since glass is a poorer thermal conductor than Si. 11 W. P. Dow has demonstrated the use of tetrazolium ions TNBT + and NTBC + for filling through-holes using constant current (CC) electroplating in CuSO 4 electrolytes containing sulfuric acid or organic acids to adjust the pH. [12][13][14] We applied these additives in CuSO 4 electrolytes to fill holes in glass interposers with aspect ratios (AR) of 5 and 10.…”

mentioning

confidence: 99%

Fast and Cost-Effective Superconformal Filling of High Aspect Ratio through Glass Vias Using MTT Additive

Fey¹,

Li²,

Dimitrov³

2017

J. Electrochem. Soc.

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Cu superconformal filling of through glass vias (TGV) of aspect ratios (AR) 6 and 10 for glass interposer applications is achieved at greatly reduced times of about 1 h and 4 h, respectively, compared to about 3 h and 12 h in the past. The DC electroplating is carried out in the presence of the additive thiazolyl blue tetrazolium bromide (MTT) in acidic (pH 2 to 4) copper methane sulfonate (CuMSA)/Cl− formulations. The applied plating conditions enable the ‘butterfly’ mechanism that nucleates hemispherical or X-shaped Cu plugs in the TGV's centers while keeping the thickness on external surfaces low. Plugs are formed in AR 6 TGV's in as little as 12 min, after which the plating can be viewed as the filling of double-sided blind vias. Issues with imperfections trapped in the plugs have been addressed by decreasing the current around the time of plug formation, then increasing it for the rest of the process. In order to fill AR 10 holes much longer times at lower current density are needed. Larger diameter AR 4 TGV's have been also successfully filled with Cu. Lab scale quantities of MTT are 8 to 14 times less expensive than the competing additives NTBC and TNBT, respectively.

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mentioning

confidence: 99%

Fast and Cost-Effective Superconformal Filling of High Aspect Ratio through Glass Vias Using MTT Additive

Fey¹,

Li²,

Dimitrov³

2017

J. Electrochem. Soc.

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“…However, this also introduces another challenge in thermal management—the heat generated by electronic chips must be dissipated within the glass package. TGVs filled with copper serve as a passive cooling solution to manage the heat generated by electronic chips 7 – 9 …”

Section: Introductionmentioning

confidence: 99%

“…TGVs filled with copper serve as a passive cooling solution to manage the heat generated by electronic chips. [7][8][9] For photonic chips, specific optical elements, such as ring resonator filters, modulators, and semiconductor optical amplifiers are sensitive to changes in temperature, as they operate at specific wavelengths. As a result, the temperature sensitive components on the photonic chips necessitate thermal control capabilities to counteract the impact of temperature fluctuations in the operating environment, thereby maintaining optimal performance.…”

mentioning

confidence: 99%

Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages

Gupta,

Tanwar,

et al. 2024

J. Optical Microsystems

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Managing the temperature of photonic chips within intricate electro-optic packages poses a notable challenge concerning the thermal crosstalk between the photonic chip, electronic chip, and the chip-fiber connection point. This is a multifaceted problem and requires packaging solutions that cannot only address high-performance thermal management but must also be scalable to high volumes. Glass has long been thought of as a suitable platform for next-generation photonic packaging due to its low thermal conductivity, which minimizes unwanted heat transfer between electronic and photonic components. Achieving proper thermal isolation between the chips and the chip-fiber interface necessitates a microscale thermal solution that guarantees accurate temperature regulation of the photonic circuitry without disrupting the optical coupling interface with the fiber array, due to the presence of epoxy used for fiber attachment. We propose a technique for the development of a substrate-integrated microthermoelectric cooler (SimTEC) for the effective temperature control of the electronic and photonic integrated devices. The proposed device uses glass substrate vias that are half-filled with p and n-type thermoelectric materials and the other half with copper. A COMSOL multiphysics model is developed to study the variations in the cooling performance of this SimTEC device based on changes in the via parameters. Interestingly, the maximum range of temperature gradient variation for SimTEC is 6 times greater compared to that of equivalent free-standing micro-TEC pillars. However, there are some challenges associated with implementing this method, as the temperature gradient (or cooling effect) achieved by SimTEC still falls short of that achieved by the free-standing micro-TEC pillars.

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“…Sukumaran et al presented the design, fabrication, and electrical characterization of small through glass vias in the glass [7] . Based on cylindrical mode expansion approaches, Li et al proposed an accurate wideband model to analyze the electrical properties of high density TGV arrays [8] . Cho et al investigated the effect of TGVs on the thermal performance of the glass interposer [9] .…”

Section: Introductionmentioning

confidence: 99%

Design of a 3D Wilkinson power divider using through glass via technology

Sang¹,

Qian²,

Xia³

et al. 2018

J. Semicond.

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Due to its low electrical loss and low process cost, a glass interposer has been developed to provide a compelling alternative to the silicon-based interposer for packaging of future 2-D and 3-D ICs. In this study, through glass vias (TGVs) are used to implement 3-D inductors for minimal footprint and large quality factor. Using the inductors and parallel plate capacitors, a compact 3-D Wilkinson power divider is designed and analyzed. Compared with some reported power dividers, the proposed TGV-based circuit has an ultra-compact size and excellent electrical performance.

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Impact of Copper Through-Package Vias on Thermal Performance of Glass Interposers

Cited by 30 publications

References 19 publications

Fast and Cost-Effective Superconformal Filling of High Aspect Ratio through Glass Vias Using MTT Additive

Fast and Cost-Effective Superconformal Filling of High Aspect Ratio through Glass Vias Using MTT Additive

Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages

Design of a 3D Wilkinson power divider using through glass via technology

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