Impact of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Ball Grid Array Packages With Different Sn-Ag-Cu Solder Joints

Zhang, Jiawei; Thirugnanasambandam, S.; Evans, John L.; Bozack, Michael J.; Sesek, Richard

doi:10.1109/tcpmt.2012.2198476

Cited by 31 publications

(7 citation statements)

References 15 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The least squares method estimates the characteristic life and slope of the weibul distribution. The r 2 value indicates the quality of the data fit [4]. The characteristic life of the SAC 105 alloys are seen to be better than the SAC 305 alloys on the SAC 305 Paste at Best Profile and also the Innolot High Profile, whereas the SAC 305 alloys outperformed the 105 alloys on the Low Profile.…”

Section: Resultsmentioning

confidence: 98%

The study of vibrational performance on different doped low creep lead free solder paste and solder ball grid array packages

Thirugnanasambandam

Sanders

Raj

et al. 2014

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Self Cite

View full text Add to dashboard Cite

Relatively little is known about the performance of the doped Ball Grid Array (BGA) packages used in semiconductor industries, even though newer products are widely being introduced to the market. This work experimentally investigates the doping effects of the BGA packages with SAC 305 alloys, caused by the vibration loading. This experiment focuses on the vibration fatigue life of 15 mm CABGA packages with 208 perimeter solder balls on a 0.8 mm pitch. The test boards were built to withstand JEDEC JESD22-B103B standards of high stress test in vibrational shaker table to assess the solder joint performance. The test boards are built with three different reflow profiles and two different stencil thicknesses 8 mil (6 mil with overprint) and 4 mil to study the differences in doping effect of the new doped alloys. The WLCSP assembly was subjected to accelerated life test of severe random vibration per board. The reliability of the component is determined by the ability of the components to withstand vibration as a result of motion produced by field operations. The deleterious effect of the mechanical loading of BGA's on the characteristic fatigue lifetime is reported. The results show that the material characteristics has a direct impact on the total time to failure. The results show that the Time-ToFailure (TTF) of the solder joint decreases with doping. The effectiveness of this characteristics was demonstrated with promising results through vibration testing of different lead free low creep alloys. This paper concludes with discussion of the deterioration intensity aging has on SAC alloys and the change in reliability due to doping. IntroductionA demand for using ball grid array (BGA) packages, with reduced substrate interconnect area, complexity, and cost of substrate assemblies, has significantly increased over the past few years. However, the failures in the BGA solder joints over vibration environments become a serious concern in electronic package industries. The reliability of these solder joints under vibrational study is considered vital to the success of BGA applications [1][2].Vibration study in electronic packages for solder joint characteristic life is still in early stages of development, in comparison to other established reliability tests like temperature cycling, drop test and thermal shock tests. The continuous reduction in the reliability of BGA package and solder ball dimensions is increasing the risk of solder joint failure under vibrational and mechanical loading. The present industry standards for vibrational testing are conducted mainly on pass or fail functional test criterion. This is a

show abstract

Section: Resultsmentioning

confidence: 98%

The study of vibrational performance on different doped low creep lead free solder paste and solder ball grid array packages

Thirugnanasambandam

Sanders

Raj

et al. 2014

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Self Cite

View full text Add to dashboard Cite

show abstract

“…The IMCs thickness will be proportional to the square root of the aging time (Gan et al , 2013a, Luo et al , 2016). During the process of aging, the relationship between the IMCs thickness and time is as follows (Zhang et al , 2012): where d is the IMCs thickness,μm; d 0 is the thickness of the IMCs in the as-received joints, μm; K is the growth rate, cm 2 /s; and t is the aging time, s.…”

Section: Resultsmentioning

confidence: 99%

Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature

Gan

Chen

Jiang

et al. 2022

SSMT

View full text Add to dashboard Cite

Purpose This study aims to evaluate the effect of thermal aging temperature on the properties of Cu/Cu joints. Design/methodology/approach A new method that 1 um Zn-particles and Sn-0.3Ag-0.7Cu (SAC0307) with a particle size of 25–38 µm were mixed to fill the joint and successfully achieved the micro-joining of Cu/Cu under ultrasonic-assisted at low-temperature, and then the effect of thermal aging temperature on the properties of Cu/Cu joints was researched. Findings The composition of the intermetallic compounds (IMCs) on the upper and lower interfaces of Cu/SACZ/Cu joints remained unchanged, which was Cu5Zn8 in aging process, and the thickness of the IMCs on the upper and lower interfaces of the Cu/SACZ/Cu joints increased accordingly. Compared with the as-received joints, the thickness of the upper and lower interfaces IMCs of the soldering aged time for 24 h increased by 404.7% and 505.5% at 150ºC, respectively. The IMCs formation tendency and the IMCs growth rate of the lower interface are larger than those of the upper interface because the soldering seam near the IMCs at the upper and lower interfaces of the as-received joints were mostly white SAC0307 balls black Zn-particles, respectively. The growth activation energy of IMCs in the upper and lower interfaces is about 89.21 and 55.11 kJ/mol, respectively. Under the same aging time, with the increase of the aging temperature, the shear strength of Cu/SACZ/Cu joints did not change significantly at first before 150ºC. When the aging temperature reached 150ºC, the shear strength of the joints decreased significantly; the shear strength of the joints was the smallest at 150ºC for 24 h, which was 39.4% lower than that of the as-received joints because the oxidation degree of Zn particles in the joint with the increase of aging temperature and time. Originality/value Cu/Cu joints were successfully achieved under ultrasonic-assisted at low-temperature.

show abstract

“…Ngo et al (2007) have demonstrated good electrical stability in VACNFs in their electromigration stress testing on on‐chip via interconnections. In addition, as is known, the growth of Cu 6 Sn 5 IMCs in Sn3.0Ag0.5Cu solder joints during isothermal aging tests can decrease the reliability performance of such solders (Zhang et al , 2012). For CA materials, two of the most common failure modes are metallic oxidation and polymer degradation at the interface during humidity/temperature testing (Rorgren and Liu, 1995).…”

Section: Resultsmentioning

confidence: 99%

Ultra‐short vertically aligned carbon nanofibers transfer and application as bonding material

Chen

2013

Soldering &Amp; Surface Mount Technology

View full text Add to dashboard Cite

PurposeThe transferred carbon nanofibers (CNFs) can be applied in flip chip package as interconnect material, as an alternative to the conventional solder and conductive adhesive (CA) materials.Design/methodology/approachThe structure of CNFs was confirmed by transmission electron microscopy (TEM). The electrical performance of the vertically aligned carbon nanofibers (VACNFs) joint was measured by four points probe method and compared to conventional lead‐free solder Sn3.0Ag0.5Cu, pure indium and silver CA. A shear test was carried out in order to evaluate the mechanical performance of VACNFs joint. After the shear test, the fracture surface was analyzed by scanning electron microscopy and energy dispersive spectroscopy (SEM‐EDS).FindingsThe results showed a high success rate in the transfer of VACNFs from growth chip to target chip. The Au‐coated CNF can be wetted well with melted indium during the transfer and bonding process. In‐Au intermetallic compound (IMC) formed on the surface of CNF. The electrical and mechanical performance of VACNFs is comparable to that of the traditional interconnect materials. The fracture surface is located at the interface between VACNFs and chips. The stacked‐cone structure of CNF can be confirmed from a cross‐section of the break CNF by TEM.Originality/valueUltra‐short VACNFs were grown and first successfully transferred to the target chip using a process which required little pressure, low temperature and short time.

show abstract

Impact of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Ball Grid Array Packages With Different Sn-Ag-Cu Solder Joints

Cited by 31 publications

References 15 publications

The study of vibrational performance on different doped low creep lead free solder paste and solder ball grid array packages

The study of vibrational performance on different doped low creep lead free solder paste and solder ball grid array packages

Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature

Ultra‐short vertically aligned carbon nanofibers transfer and application as bonding material

Contact Info

Product

Resources

About