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A methodology was developed to correlate field life with observed degradation for electronics modules. This procedure was developed by identifying common deterioration characteristics in field units, modeling observed trends and then developing a model to predict future deterioration trends. This particular method focused on the deterioration of solder joint strength due to solder fatigue and comparing these values with a threshold based on known electrical failures. A conditional probability density function was formulated and quantified for both random shear strength and the minimum shear strength within a module. The conditional probability density function characterized both the changing mean and variance for a normally distributed random shear strength. With this methodology, time or mileage (life) prediction is based on the probability that the minimum performance response is less than a defined failure threshold. The methodology described herein promises to be an effective product development tool as the effect of design changes on product life can be more quickly and easily evaluated. While the technique developed herein is applicable to all electronic designs, the method was developed with a particular focus on understanding these relationships for automotive (harsh environment) applications.

Recently, an intermittent hot-pressing process had been developed and applied to produce bamboo bundle laminated veneer lumber (BLVL) joints with lengths of more than 6 m. According to our previous studies, there was a major difference in the physical and mechanical performance of hot-pressing joints and at adjacent positions on the lumber. In this paper, heat transfer and the effects of various aging temperatures on the mechanical performance of the joints of intermittent hot-pressed BLVLs were studied. During the hot-pressing process, there were noticeable different temperature changes on the board. In addition, degradation of the modulus of elasticity (MOE) and modulus of rupture (MOR) values on the joints was greater than that on the adjacent positions of the BLVLs, and the degradation increased with increasing aging temperature. Because of the low interfacial bonding strength of the joints caused by the pre-curing effect during the hot-pressing process, the MOR was more sensitive to hydrothermal conditions. Therefore, when BLVLs produced by intermittent hot-pressing are used as engineering components, the joints should be well-designed and arranged to avoid being used in the same cross-section.

The solder joint reliability of ceramic chip resistors assembled to laminate substrates has been a long time concern for systems exposed to harsh environments. In this work, the thermal cycling reliability of several 2512 chip resistor lead‐free solder joint configurations has been investigated. In an initial study, a comparison has been made between the solder joint reliabilities obtained with components fabricated with both tin‐lead and pure tin solder terminations. In the main portion of the reliability testing, two temperature ranges (−40‐125°C and −40‐150°C) and five different solder alloys have been examined. The investigated solders include the normal eutectic Sn‐Ag‐Cu (SAC) alloy recommended by earlier studies (95.5Sn‐3.8Ag‐0.7Cu), and three variations of the lead‐free ternary SAC alloy that include small quaternary additions of bismuth and indium to enhance fatigue resistance.