2014 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS) 2014
DOI: 10.1109/apccas.2014.7032854
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Impact of on-chip interconnects on vertical signal propagation in 3D ICs

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“…Fig. 12 shows the equivalent circuit, which appended the model of coarse-grained substrate contacts [20] to the model in [18,19]. Table I lists the physical and material parameters used in our analysis.…”
Section: Resultsmentioning
confidence: 99%
“…Fig. 12 shows the equivalent circuit, which appended the model of coarse-grained substrate contacts [20] to the model in [18,19]. Table I lists the physical and material parameters used in our analysis.…”
Section: Resultsmentioning
confidence: 99%