2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual.
DOI: 10.1109/relphy.2005.1493119
|View full text |Cite
|
Sign up to set email alerts
|

Impact of plasma induced damage on PMOSFETs Tin/HF silicate stack

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
8
0

Publication Types

Select...
5
3

Relationship

1
7

Authors

Journals

citations
Cited by 12 publications
(8 citation statements)
references
References 11 publications
0
8
0
Order By: Relevance
“…15) There have been many reports on PCD to high-k MOSFETs. [15][16][17][18][19] The damage is usually quantified by measuring the gate leakage current increase 16,17) and threshold voltage shift (ÁV th ). 15,19) Since this charging damage is considered to be inevitable in present-day plasma equipment, antenna design rules that limit the maximum antenna ratio in circuits [20][21][22] and protection diode schemes 13,14,20,[23][24][25][26] have been introduced to minimize the damage.…”
Section: Introductionmentioning
confidence: 99%
“…15) There have been many reports on PCD to high-k MOSFETs. [15][16][17][18][19] The damage is usually quantified by measuring the gate leakage current increase 16,17) and threshold voltage shift (ÁV th ). 15,19) Since this charging damage is considered to be inevitable in present-day plasma equipment, antenna design rules that limit the maximum antenna ratio in circuits [20][21][22] and protection diode schemes 13,14,20,[23][24][25][26] have been introduced to minimize the damage.…”
Section: Introductionmentioning
confidence: 99%
“…However, the introduction of high-K dielectrics, which are supposed to replace SiO2, again raises concerns about their susceptibility to plasma-induced charging [3][4][5]. The complexity of high-K gate stack integration in conjunction with metal electrodes poses additional challenges since the effects of plasma-induced damage from the novel processes may not yet be known [3].…”
Section: Introductionmentioning
confidence: 99%
“…The occurrence of additional gate dielectric leakage implies the existence of additional current paths within the gate dielectric layers. Prior to conductive path formation within the dielectric layers, sufficient damage (i.e., traps and defects) accumulates to influence the initial V TH [13] and DV TH shifts after electrical stress [22]. Further, damaged transistors with a large antenna ratio have a significant difference in initial V TH and simultaneously depict great influence on DV TH shift after BTI stress compared with undamaged transistors.…”
Section: Bti Instability and Silc Increasementioning
confidence: 99%
“…Paying significant attention to the PID-enhanced transistor reliability degradation is necessary as CMOS technology continues to scale. Previous studies show the PID impacts high-k/metal-gate transistors [13,14]. However, a comprehensive study for comparing the PID effects between SiO 2 /poly-gate and high-k/metal-gate transistors on the antenna ratio dependence and gate dielectric thickness dependence in terms of damage-enhanced gate dielectric failure and damage-enhanced transistor reliability degradation is still lacking.…”
Section: Introductionmentioning
confidence: 99%