2010 IEEE International Conference on Integrated Circuit Design and Technology 2010
DOI: 10.1109/icicdt.2010.5510298
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Impact of resistance drift on multilevel PCM design

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Cited by 4 publications
(2 citation statements)
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“…This phenomenon is known as resistance drift. Resistance drift is believed to be the result of structural relaxation (SR) physical phenomena, which is a thermally-activated, atomic rearrangement of the amorphous structure [11]. It has been observed [9,12] that drift is much more significant on high resistance states (e.g.…”
Section: B Resistance Drift and Its Impact On Mlcmentioning
confidence: 99%
“…This phenomenon is known as resistance drift. Resistance drift is believed to be the result of structural relaxation (SR) physical phenomena, which is a thermally-activated, atomic rearrangement of the amorphous structure [11]. It has been observed [9,12] that drift is much more significant on high resistance states (e.g.…”
Section: B Resistance Drift and Its Impact On Mlcmentioning
confidence: 99%
“…Without loss of generality, we demonstrate the design-technology tradeoff for an OxRRAM-based neuromorphic PE, where each NVM cell can be programmed to the following four resistance levels (i.e., 2-bit per synapse) -1.5 KΩ, 5.78 KΩ, 13.6 KΩ, and 73 KΩ [19,20,31,64,74]. Furthermore, we show our analysis for four process technology nodes -16nm, 22nm, 32nm, and 45nm, which are obtained from our technology provider.…”
Section: Design-technology Tradeoff Analysismentioning
confidence: 99%