2012
DOI: 10.1016/j.cap.2012.03.005
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Impact of rough silicon buffer layer on electronic quality of GaAs grown on Si substrate

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Cited by 5 publications
(2 citation statements)
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“…A low concentration of hydrofluoric acid for the etching solution leads to obtain a homogenous porous layer [9]. For the preparation of the etched silicon surface (EtSi), the porous silicon substrate was etched in NaOH solution [10] to break up the porous silicon layer and produce a rugged surface [11].…”
Section: Substrates Preparationmentioning
confidence: 99%
“…A low concentration of hydrofluoric acid for the etching solution leads to obtain a homogenous porous layer [9]. For the preparation of the etched silicon surface (EtSi), the porous silicon substrate was etched in NaOH solution [10] to break up the porous silicon layer and produce a rugged surface [11].…”
Section: Substrates Preparationmentioning
confidence: 99%
“…However, the main problem encountered for III-V element-based solar cells mainly lies in the development of large surface photovoltaic structures due to their high cost, making the employment of low cost substrates highly desirable. Accordingly, the epitaxial growth of the GaAs layer on Si substrate has attracted considerable attention owing to their large area availability, low cost and high mechanical strength [ 9 , 10 , 11 , 12 , 13 , 14 ]. Promising InAs/GaAs QD-based optoelectronic devices, directly grown on Si substrate, have already been reported [ 15 , 16 , 17 , 18 , 19 , 20 ].…”
Section: Introductionmentioning
confidence: 99%