New materials often force modification in a metal-oxide-semiconductor field-effect transistor (MOSFET) fabrication process and a device structure. In our investigation, a high-stress silicon nitride (SiN) contact etch stopper layer (CESL), which improves device performance by straining the Si lattice, was used as the modified structure. A portion of its gate surround was cut to fabricate a fully silicided (FUSI) metal gate. FET characteristics of a polycrystalline silicon (poly-Si) gate and a Ni-FUSI gate MOSFET with a discontinuous CESL were compared with those of a poly-Si gate MOSFET with an ordinary continuous CESL for several SiN-stress conditions. It was found that the removal of a gate-top CESL diminishes mobility modulation effects of a high-stress CESL. It was also demonstrated that stress due to a FUSI gate compensates the effect of gate-top CESL removal. Mobility enhancement utilizing a high-stress SiN film was still effective for a FUSI gate process.