Impact of TSV bump and redistribution layer on crosstalk delay and power loss

Chandrakar, Shivangi; Gupta, Deepika; Majumder, Manoj Kumar

doi:10.1016/j.memori.2023.100040

Cited by 4 publications

(1 citation statement)

References 33 publications

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“…For example, designing coaxial TSV structures with a central signal transmission conductor surrounded by concentric ground loops can effectively reduce signal loss and coupling noise (shown in Figure 7b) [40]. Adjusting the shape and size of protrusions, such as tapered protrusions, can also help to improve crosstalk delay due to their lower capacitive coupling and smaller volume fraction [41,42]. Additionally, incorporating shielding structures, such as adding ground shielding rings around TSVs (shown in Figure 7a) [43], introducing ground interconnect arrays (shown in Figure 7c) [44], or implementing appropriate grounding in the package enclosure [45], can further mitigate crosstalk.…”

Section: Electromagnetic Reliabilitymentioning

confidence: 99%

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Wang,

Liu,

Huo

et al. 2024

Micromachines

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With the advancement of Moore’s Law reaching its limits, advanced packaging technologies represented by Flip Chip (FC), Wafer-Level Packaging (WLP), System in Package (SiP), and 3D packaging have received significant attention. While advanced packaging has made breakthroughs in achieving high performance, miniaturization, and low cost, the smaller thermal space and higher power density have created complex physical fields such as electricity, heat, and stress. The packaging interconnects responsible for electrical transmission are prone to serious reliability issues, leading to the device’s failure. Therefore, conducting multi-field coupling research on the reliability of advanced packaging interconnects is necessary. The development of packaging and the characteristics of advanced packaging are reviewed. The reliability issues of advanced packaging under thermal, electrical, and electromagnetic fields are discussed, as well as the methods and current research of multi-field coupling in advanced packaging. Finally, the prospect of the multi-field coupling reliability of advanced packaging is summarized to provide references for the reliability research of advanced packaging.

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