“…The deposition bath is formed by a metal salt, a complexing and reducing agent, a stabilizer, an inhibitor, and others (pH regulators, wetting and polishing agents) [11,12]. Factors such as temperature, time, pH, and chemical composition directly influence the morphology, composition, and final structure of electroless coating, as well as the electrical and magnetic properties [12][13][14]. For example, thickness and size grain dependence were observed with immersion duration of the substrate in the deposition bath [15]; pH has a direct relation with the reaction rate [14]; the activation process was shown to control the rate and mechanism of coating deposition [16], while substrate morphology affects the roughness, hydrophobicity, and thermal conductivity of the electroless coating [17].…”