Implementation and Characterization of a Medical Ultrasound Phased Array Probe With New Pb-Free Soldering Materials

Catelani, Marcantonio; Scarano, Valeria L.; Bertocci, Francesco

doi:10.1109/tim.2010.2057670

Cited by 12 publications

(10 citation statements)

References 22 publications

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“…In solarphotovoltaic industry ECA can be used for the electrical connection of transparent conductive oxide (TCO) to printed circuit board (PCB) pads and replacement of solder joints of Cu/Sn ribbon wire from cell-to-cell. In medical applications this material can be useful for circuits requiring implantation or biocompatibility, as electrical connections of die in X-ray circuits, in ultrasound applications [10,11] and in pacemaker. It can attach waveguides, die bonds laser diodes and heatsinks in the high power laser circuits.…”

Section: Electrically Conductive Adhesivementioning

confidence: 99%

“…Since electrically conductive epoxies require temperatures of only 150 • C or less to cure, isotropic epoxies are an ideal alternative to solder on thermally sensitive parts. The performance of these materials in particular application was shown in [10,11], instead in order to have a general validity of the research activity we propose specimens were implemented according to a specific geometry and a proper procedure as shown in [17].…”

Section: Electrically Conductive Adhesivementioning

confidence: 99%

See 1 more Smart Citation

Optimization of accelerated testing through design of experiment for ageing of lead-free electronic interconnection material

Catelani

Scarano

Berni

2013

Int. J. Metrol. Qual. Eng.

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Abstract. Understanding the ageing of materials for electronic application is a complex challenge, in particular for composite material as electrically conductive adhesive consisting of a nonconductive polymer binder and conductive filler particles. This research involves a large amount of parameters related to both operating conditions and material structure, which act together. Accelerated testing, with the aim to consume rapidly lifetime without inducing incorrect failure mechanisms, is difficult to optimize and its modelling to describe the ageing process is a challenge. To reach this aim could be interesting for the characterization of the material but above all for the general validity of the proposed methodology.

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Section: Electrically Conductive Adhesivementioning

confidence: 99%

Section: Electrically Conductive Adhesivementioning

confidence: 99%

Optimization of accelerated testing through design of experiment for ageing of lead-free electronic interconnection material

Catelani

Scarano

Berni

2013

Int. J. Metrol. Qual. Eng.

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show abstract

“…Ensuring the solder joint reliability is one of the most critical design aspects of electronic assemblies and has frequently been analyzed, [1] [7][8] [9] [10]. In particular, the lead-free soldering technology raises a couple of questions concerning the joint reliability under different test and field cycling conditions and also other questions about the effects of alloying contents.…”

Section: Introductionmentioning

confidence: 99%

Wideband measurement method for prognosis of soldering failure on electronic boards

Adamo

Andria

Nisio

et al. 2014

2014 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) Proceedings

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Reliability specifications for solder joints, as well as for all electronic components, become a fundamental element in the qualification of an electronic product. This importance increases if new lead-free alloys are considered and then under test. An accelerated thermal test is proposed for an early reliability evaluation and the definition of failure parameters is addressed. The traditional technique employed for failure monitoring of solder joints is the DC resistance measurement. This paper reviews and assesses the DC resistance monitoring during reliability tests of lead-free solder materials used for electronic boards production. Moreover through a failure prognosis measurement technique, considering wideband measurements, the possibility to identify the failure occurrence earlier than the DC resistance method is evaluated. An experimental study on a pass band filter soldered by a new lead free alloy is performed to evaluate reliability performance.

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“…For this Pb-free solder material the performances were evaluated both from the morphological and electric point of view [2]. In spite of the disadvantages as high price and long duration of soldering phase, the preliminary experimental results on the use of ECA demonstrate to achieve small thickness, low working temperature, robust interconnections and good behaviours of the electrical response of the array transducers [3].…”

Section: Introductionmentioning

confidence: 99%

“…The innovative contribution, with respect to the traditional approach, was given by the use of new kind of soldering material and process and the characterization of implemented instrument under environmental, electrical and mechanical stresses. The innovative soldering process, in which the piezoelectric platelet was soldered to the microconnections with Ag-ECA, and the preliminary results on electro-acoustic performance of the medical array transducer after environmental tests were illustrated in [3]. In this paper a new characterization of the prototype behavior under electrical test, in particular high-voltage pulse stress, is proposed [9].…”

Section: Introductionmentioning

confidence: 99%

High-voltage pulse stress on biomedical ultrasound probe soldered with Ag-ECA

Catelani

Scarano

Bertocci

2010

2010 IEEE International Workshop on Medical Measurements and Applications

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In this paper the results from a study of high-voltage pulse stressing effects on ultrasound array transducers are presented. The ultrasound transducers have been implemented with a new Pb-free soldering technology, using Silver Electrically Conductive Adhesive. The conductive adhesive have been used among the platelet of piezoelectric and fingers of connection for the implementation of phased array transducer. In order to evaluate the reliability of the biomedical instrument electrical tests are proposed. Some experimental results through a measurement system for the electro-acoustic characterization of the medical probe before and after stress test are obtained and analyzed. Keywords -Ag-ECA; electrical stress test, high-voltage pulse, phased array probe; silver electrically conductive adhesive; ultrasound piezoelectric transducer.I.978-1-4244-6290-2/10/$26.00 ©2010 IEEE

show abstract

Implementation and Characterization of a Medical Ultrasound Phased Array Probe With New Pb-Free Soldering Materials

Cited by 12 publications

References 22 publications

Optimization of accelerated testing through design of experiment for ageing of lead-free electronic interconnection material

Optimization of accelerated testing through design of experiment for ageing of lead-free electronic interconnection material

Wideband measurement method for prognosis of soldering failure on electronic boards

High-voltage pulse stress on biomedical ultrasound probe soldered with Ag-ECA

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