Optimization of accelerated testing through design of experiment for ageing of lead-free electronic interconnection material

Abstract

Abstract. Understanding the ageing of materials for electronic application is a complex challenge, in particular for composite material as electrically conductive adhesive consisting of a nonconductive polymer binder and conductive filler particles. This research involves a large amount of parameters related to both operating conditions and material structure, which act together. Accelerated testing, with the aim to consume rapidly lifetime without inducing incorrect failure mechanisms, is difficult to optimize and its modelling to describe the ageing process is a challenge. To reach this aim could be interesting for the characterization of the material but above all for the general validity of the proposed methodology.

Wideband measurement method for prognosis of soldering failure on electronic boards

“…Testing is used in the electronics industry to evaluate product reliability, and thus qualify a product for quality in use. To decrease the total time and cost required assessing reliability of a product, accelerated tests are applied, [12]. In order to obtain meaningful reliability data from tests, it is fundamental, but critical, to choose a proper failure criterion and use the appropriate measurement technique to monitor the failure events.…”

“…In this phase of the research we chose to stress the soldering specimens only thermally, maintaining the relative humidity equal to 20%, in order not to introduce different failure mechanisms, [20] [12]. We propose to perform accelerated thermal testing, recording DC and wideband measures while the solder joints were stressed and to the end evaluating which measurement method has early located a failure, also a soft failure.…”

“…Furthermore the methods of stress application (constant or time varying), and severities in general, are fundamental in the life model implementation. [12] Several accelerated models were proposed in literature to obtain lifetime data, considering thermal fatigue, vibration, electrical solicitations and their interaction, for soldering material alloy, [13][14] [15]; while there is a lack of studies on new InnoLot accelerated life model, the characterization of their aging and the relative experimental data analysis.…”