Implementation of Packaged Integrated Antenna With Embedded Front End for Bluetooth Applications

Abstract

Abstract-The design, integration and realization of system in enhanced package approach towards fully functional system level integration by using a compact Bluetooth USB dongle as the demonstrator is presented here. The integration was done on FR4 substrates, which is totally compatible with today's printed circuit board manufacturing capability. A commercially available Bluetooth integrated chip was chosen as the chipset of our demonstrator, and a package integrated antenna together with an embedded front end completes the system in package integration. The front end developed here is based on an embedded meander line combline filter and an embedded transformer balun. The filter has a 35% area reduction when compared with the classical combline filter and similar performance. The balun has the coils distributed on three layers that minimized the board area needed it and optimizes the performances. The proposed packaged integrated antenna approach is successfully demonstrated here and the new module shows excellent performance when compared with a commercial solution, surpassing the normal Bluetooth class II dongle range which is up to 10 m and increasing the module range up to 120 m without an extra power amplifier.Index Terms-Dielectric resonator antenna (DRA), embedded front end, embedded passives, package integrated antenna, system in package (SiP), wireless module.

Effect of DMSO/H2O coagulation bath on the structure and property of polyacrylonitrile fibers during wet‐spinning

“…Usually, the antennas and filters are made on different external packages. Recently, the system‐in‐package, system‐on‐chip, low‐temperature‐cofired‐ceramic approaches have been extensively used to integrate all wireless front‐end devices into a single module for reducing the footprint [2, 3]. In these cases, the antenna and filter can be fabricated separately on different metallic layers in the package, at the cost of increasing the design complexity.…”

High gain D‐band hybrid integrated on‐chip antenna based on low‐cost printed circuit board packaging technology

“…System-in-package (SiP) is widely adopted in conventional wireless system packaging. 1,2 This method integrates horizontally and occupies a relatively large area, which is unsuitable for miniaturized wireless communication systems and other wireless sensing systems such as radar. In SiP, the antennas and chips are usually interconnected by bonding wires.…”

Small antenna design for very compact devices and wearables

“…Hence we focused on implementations of very small printed antennas that could operate at the 2.45 GHz ISM band. An implementation that is similar to ours in terms of size and characteristics was presented in [9], where the authors use a dielectric resonator antenna which serves also as an encapsulation for the system. Still, their implementation needs more space than we have available and is very restrictive in terms of size reduction.…”