Importance of reliability for power electronic circuits, case study: Inrush current test and calculating of fuse melting point

Demir, Murat; Kahramanoglu, Gurmen; Yıldız, Ali Bekir

doi:10.1109/epepemc.2016.7752101

Cited by 9 publications

(3 citation statements)

References 6 publications

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“…For this reason, their practical implementation and selection in engineering modern electronic devices have been included in [20,21]. One of the more interesting works is [22], which proposes a practical methodology that enables selecting fuse-links with adequate parameters in the context of their application in electronic devices of a specific type. The entire issue is approached from the perspective of reliability.…”

Section: Literature Reviewmentioning

confidence: 99%

Method for Evaluating the Effectiveness of Electrical Circuit Protection with Miniature Fuse-Links

2023

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Miniature fuses as an anti-damage subsystem perform the important function of protecting electronic devices and systems against permanent damage that may result in electric shocks, fire risks, etc. Their role becomes particularly important when they are installed in such special systems as electronic security systems (ESS). For this reason, there is a need for practical verification of their protective properties. The article presents the results of destructive tests of the circuit-breaking time of miniature fuse-links considered in terms of their usefulness in the ESS with the use of a passive experimental add-on, developed at the Military University of Technology in Warsaw. The characteristics of the measuring attachment circuit and the measurement methodology used were presented. Based on the obtained measurement points of the obtained time–current characteristics, an attempt was made to develop their mathematical model using numerical methods in the field of non-linear regression, using the least squares optimization method (Levenberg–Marquardt algorithm). An exemplary classification of miniature fuse-links has been proposed due to their protective properties of circuits in the context of their use in electronic security systems. The considerations were summarized with an economic analysis of the tested fuse links. The conclusions include proposals for changes to the provisions of the European standard PN-EN 50131-1:2009 “Alarm systems: Intrusion and hold-up systems Part 1: System requirements” and Polish Defence Standard NO-04-A004-8 2016 “Military facilities. Alarm systems. Part 8: Operation”.

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Section: Literature Reviewmentioning

confidence: 99%

Method for Evaluating the Effectiveness of Electrical Circuit Protection with Miniature Fuse-Links

2023

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“…The application of power devices in the industrial and automotive fields requires the fulfillment of various specifications and standards related to the reliability of power semiconductor devices [1], [2]. The concept of analyzing the reliability of power devices is fundamental to obtaining an acceptable trade-off between service costs and product costs [3].…”

Section: Introductionmentioning

confidence: 99%

Influence of Power Cycling Test Methodology on the Applicability of the Linear Damage Accumulation Rule for the Lifetime Estimation in Power Devices

Vaccaro

Magnone

2023

IEEE Trans. Power Electron.

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The lifetime of power semiconductor devices, operating under a given mission profile and subjected to power cycling stress, is conventionally estimated under the assumption of linear damage accumulation rule, that is the application of the Miner's rule. To this purpose, lifetime models must be properly defined allowing to take into account for the relevant parameters of power cycling stress. This work shows how to estimate a cumulative distribution function in the case of an arbitrary temperature swing profile, starting from the statistical distribution at constant power cycling conditions. It is found that the accuracy of the linear damage accumulation rule is related to the experimental methodology adopted for power cycling tests. A detailed experimental activity is carried out on packaged IGBT devices, providing useful guidelines for the definition of lifetime models to be adopted in the Miner's rule.

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“…Reliability emphasizes how long electronic materials work well without predicted failure, and this idea is especially necessary for state-of-the-art electronic devices. A lack of reliability can lead to many undesirable effects related to issues like safety, maintenance, profit, and yield [36]. In electronic devices that are used for long periods of time, reliability in terms of humidity stability is regarded as one of the most critical variables.…”

Section: Introductionmentioning

confidence: 99%

Accelerated temperature and humidity testing of 2D SnS₂ thin films made via four-inch-wafer-scale atomic layer deposition

et al. 2020

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Tin disulfide (SnS 2 ) has emerged as a promising two-dimensional (2D) material due to its excellent electrical and optical properties. However, research into 2D SnS 2 has mainly focused on its synthesis procedures and applications; its stability to humidity and temperature has yet to be studied. In this work, 2D SnS 2 thin films were grown by atomic layer deposition (ALD) and characterized by various tools, such as x-ray diffraction, Raman analysis, and transmission electron spectroscopy. Characterization reveals that ALD-grown SnS 2 thin films are a high-quality 2D material. After characterization, a four-inch-wafer-scale uniformity test was performed by Raman analysis. Owing to the quality, large-area growth enabled by the ALD process, 98.72% uniformity was obtained. Finally, we calculated the thermodynamic equations for possible reactions between SnS 2 and H 2 O to theoretically presurmise the oxidation of SnS 2 during accelerated humidity and temperature testing. After the accelerated humidity and temperature test, x-ray diffraction, Raman analysis, and Auger electron spectroscopy were performed to check whether SnS 2 was oxidized or not. Our data revealed that 2D SnS 2 thin films were stable at humid conditions.

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Importance of reliability for power electronic circuits, case study: Inrush current test and calculating of fuse melting point

Cited by 9 publications

References 6 publications

Method for Evaluating the Effectiveness of Electrical Circuit Protection with Miniature Fuse-Links

Method for Evaluating the Effectiveness of Electrical Circuit Protection with Miniature Fuse-Links

Influence of Power Cycling Test Methodology on the Applicability of the Linear Damage Accumulation Rule for the Lifetime Estimation in Power Devices

Accelerated temperature and humidity testing of 2D SnS₂ thin films made via four-inch-wafer-scale atomic layer deposition

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Importance of reliability for power electronic circuits, case study: Inrush current test and calculating of fuse melting point

Cited by 9 publications

References 6 publications

Method for Evaluating the Effectiveness of Electrical Circuit Protection with Miniature Fuse-Links

Method for Evaluating the Effectiveness of Electrical Circuit Protection with Miniature Fuse-Links

Influence of Power Cycling Test Methodology on the Applicability of the Linear Damage Accumulation Rule for the Lifetime Estimation in Power Devices

Accelerated temperature and humidity testing of 2D SnS2 thin films made via four-inch-wafer-scale atomic layer deposition

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Accelerated temperature and humidity testing of 2D SnS₂ thin films made via four-inch-wafer-scale atomic layer deposition