Improved a priori interconnect predictions and technology extrapolation in the GTX system

Ground bounce is a major contributor to substrate noise generation due to the resonance caused by the inductance and the VDD-VSS admittance that consists of the on-chip digital circuit capacitance of the MOS transistors, the decoupling, and the parasitics arising from the interconnect. This paper addresses (1) the dependence of the VDD-VSS admittance on the different states of the circuit and the interconnect and (2) the computation of total supply current with ground bounce. The VDD-VSS admittances of several test circuits are computed with 13% maximum error relative to the measurements on a test ASIC fabricated in a 0.18pm CMOS process on a high-ohmic substrate with 18Qcm resistivity. It is also shown that this admittance depends on the connectivity of the gates to the supply rail rather than their connectivity among each other.

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Digital circuit capacitance and switching analysis for ground bounce in ICs with a high-ohmic substrate

Badaroglu

Plas

Wambacq

et al. 2004

IEEE J. Solid-State Circuits

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Ground bounce is a major contributor to substrate noise generation due to the resonance caused by the inductance and the VDD-VSS admittance that consists of the on-chip digital circuit capacitance of the MOS transistors, the decoupling, and the parasitics arising from the interconnect. This paper addresses (1) the dependence of the VDD-VSS admittance on the different states of the circuit and the interconnect and (2) the computation of total supply current with ground bounce. The VDD-VSS admittances of several test circuits are computed with 13% maximum error relative to the measurements on a test ASIC fabricated in a 0.18µm CMOS process on a high-ohmic substrate with 18Ωcm resistivity. It is also shown that this admittance depends on the connectivity of the gates to the supply rail rather than their connectivity among each other.

show abstract

Improved a priori interconnect predictions and technology extrapolation in the GTX system

Cited by 9 publications

References 39 publications

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A CAD methodology and tool for the characterization of wide on-chip buses

Digital circuit capacitance and switching analysis for ground bounce in ICs with a high-ohmic substrate

Digital circuit capacitance and switching analysis for ground bounce in ICs with a high-ohmic substrate

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