Improved analysis of microbeams under mechanical and electrostatic loads

Choi, Byungcho; Lovell, Edward G.

doi:10.1088/0960-1317/7/1/005

Cited by 97 publications

(61 citation statements)

References 2 publications

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“…To validate our results, we compare the results of the maximum deflection calculated using current approach to those reported (Choi and Lovell 1997) based on above the parameters of the coupled-field MEMS capacitive switch and no axial load, the static deflection curve is displayed in Fig. 3 where the applied voltages square vary from 0 to 70 V. It is obtained that the results from the two methods are nearly undistinguishable, and there is good agreement between the two sets of results.…”

Section: Static Response Of Microbeammentioning

confidence: 67%

Numerical simulation and analysis of electrically actuated microbeam-based MEMS capacitive switch

Wang

et al. 2008

Microsyst Technol

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The MEMS capacitive switch based on fixedfixed microbeam has garnered significant attention due to their geometric simplicity and broad applicability. The accurate model which describes the multiphysical coupledfield of MEMS capacitive switch should be developed to predict their electromechanical behaviors. The improved macromodel of the fixed-fixed microbeam-based MEMS capacitive switch is presented to investigate the behavior of electrically actuated MEMS capacitive switch in this paper, the macromodel provides an effective and accurate design tool for this class of MEMS devices because of taking account into some effects simultaneously including fringing field effect, midplane stretching effect, residual stress and multiphysical coupled-field effect. The numerical analysis of mechanical characterizations of electrically actuated microbeam-based MEMS capacitive switch are performed by the finite element Newmark method, and the performances of static and dynamic of MEMS capacitive switch are obtained. The numerical results show that, with only a few nodes used in the computation, the FEMNewmark gives the identical results to other numerical methods, such as the shooting method and experiments. Moreover, the proposed model can offer proper and convenient approach for numerical calculations, and promote design of MEMS devices.

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Section: Static Response Of Microbeammentioning

confidence: 67%

Numerical simulation and analysis of electrically actuated microbeam-based MEMS capacitive switch

Wang

et al. 2008

Microsyst Technol

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“…The pull-in instability is not expected for those MEMS devices [16]- [24] in modeling sense because of their loading types analyzed above. However, in reality, electrostatic voltage could be left over during the fabrication to become a pronounced factor affecting the behavior of structures [26], and pull-in may happen for those curved/V-shaped MEMS devices [16]- [24] if the left-over electrostatic voltage is large enough. So far, the study of combining the two instabilities, to the authors' best knowledge, has not been presented.…”

Section: Introductionmentioning

confidence: 99%

Snap-Through and Pull-In Instabilities of an Arch-Shaped Beam Under an Electrostatic Loading

Yin¹,

Wang

et al. 2007

J. Microelectromech. Syst.

106

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Abstract-The snap-through and pull-in instabilities of the micromachined arch-shaped beams under an electrostatic loading are studied both theoretically and experimentally. The pull-in instability that results in a system collision with an electrode substrate may lead to a system failure and, thus, limits the system maximum displacement. The beam/plate structure with a flat initial configuration under an electrostatic loading can only experience the pull-in instability. With the different arch configurations, the structure may experience either only the pull-in instability or the snap-through and pull-in instabilities together. As shown in our computation and experiment, those arch-shaped beams with the snap-through instability have the larger maximum displacement compared with the arch-shaped beams with only the pull-in stability and those with the flat initial configuration. The snapthrough occurs by exerting a fixed load, and the structure experiences a discontinuous displacement jump without consuming power. Furthermore, after the snap-through jump, the structures are demonstrated to have the capacity to withstand further electrostatic loading without pull-in. Those properties of consuming no power and increasing the structure deflection range without pull-in is very useful in microelectromechanical systems design, which can offer better sensitivity and tuning range.

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“…Microstructure is fabricated by MEMS technology and used in microsensors and microactuators. During the manufacturing, electrostatic loading can be left over to become a pronounced factor affecting the behavior of microbeam in some electrostatic devices [6]. As the microstructure is balanced between electrostatic attractive force and mechanical (elastic) restoring force, both electrostatic and elastic restoring force increase when the electrostatic voltage increases.…”

Section: Introductionmentioning

confidence: 99%

“…Axial force appears in the governing equation as a linear second order term, which can either stiffen (tensile load) or soften (compressive load) the structure. The axial force influence on the beam pull-in displacement and voltage is investigated by many [2,3,6,17] and is clearly indicated by the ratio of the two dimensionless numbers [17]. Electrostatic force also has the softening effect on the structure stiffness [18].…”

Section: Introductionmentioning

confidence: 99%

“…Meanwhile, using the orthogonality of the mode shapes can greatly reduce the computation effort [18]. Choi and Lovell [6] provide a model on the continuous system, but their model on mechanical restoring force part is linear. Because many MEMS structures may experience large deflection, AbdelRahman et al [2] provide a refined model which includes the nonlinear mechanical restoring force due to the mid-plane stretching, which stiffens the structure.…”

Section: Introductionmentioning

confidence: 99%

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Numerical and analytical study on the pull-in instability of micro-structure under electrostatic loading

Zhang

Zhao

2006

Sensors and Actuators A: Physical

148

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The one-mode analysis method on the pull-in instability of micro-structure under electrostatic loading is presented. Taylor series are used to expand the electrostatic loading term in the one-mode analysis method, which makes analytical solution available. The one-mode analysis is the combination of Galerkin method and Cardan solution of cubic equation. The one-mode analysis offers a direct computation method on the pull-in voltage and displacement. In low axial loading range, it shows little difference with the established multi-mode analysis on predicting the pull-in voltages for three different structures (cantilever, clamped-clamped beams and the plate with four edges simply-supported) studied here. For numerical multi-mode analysis, we also show that using the structural symmetry to select the symmetric mode can greatly reduce both the computation effort and the numerical fluctuation.

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Improved analysis of microbeams under mechanical and electrostatic loads

Cited by 97 publications

References 2 publications

Numerical simulation and analysis of electrically actuated microbeam-based MEMS capacitive switch

Numerical simulation and analysis of electrically actuated microbeam-based MEMS capacitive switch

Snap-Through and Pull-In Instabilities of an Arch-Shaped Beam Under an Electrostatic Loading

Numerical and analytical study on the pull-in instability of micro-structure under electrostatic loading

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