Improved Methodology of Cross-Sectional SEM Analysis of Thin-Film Multilayers Prepared by Magnetron Sputtering

Abstract

In this work, an improved methodology of cross-sectional scanning electron microscopy (SEM) analysis of thin-film Ti/V/Ti multilayers was described. Multilayers with various thicknesses of the vanadium middle layer were prepared by magnetron sputtering. The differences in cross sections made by standard fracture, focused ion beam (FIB)/Ga, and plasma focused ion beam (PFIB)/Xe have been compared. For microscopic characterization, the Helios NanoLab 600i microscope and the Helios G4 CXe with the Quanta XFlash 630 energy dispersive spectroscopy detector from Bruker were used. The innovative multi-threaded approach to the SEM preparation itself, which allows us to retain information about the actual microstructure and ensure high material contrast even for elements with similar atomic numbers was proposed. The fracture technique was the most noninvasive for microstructure, whereas FIB/PFIB results in better material contrast (even than EDS). There were only subtle differences in cross sections made by FIB-Ga and PFIB-Xe, but the decrease in local amorphization or slightly better contrast was in favor of Xe plasma. It was found that reliable information about the properties of modern nanomaterials, especially multilayers, can be obtained by analyzing a two-part SEM image, where the first one is a fracture, while the second is a PFIB cross section.

An Edge Detection Algorithm for SEM Images of Multilayer Thin Films

“…Scanning electron microscopy (SEM) is a widely used surface analysis technique for characterizing these materials at the nanoscale level. Sikora [1] emphasized that obtaining reliable information about nanostructures within multilayer thin film materials in electronic devices primarily relies on acquiring both structural details and focused ion beam (FIB)/plasma focused ion beam (PFIB) cross sections from SEM images. Pandey et al [2] employed image processing techniques to identify minute particles present on film surfaces using SEM images.…”

Elektronenmikroskopische Untersuchung des Einflusses elektrischer Felder auf das Sinterverhalten von Oxidkeramiken

“…Regelfall wird bei der FIB-Prozedur im Vorfeld eine Schutzschicht aus W oder Pt auf die Probe aufgebracht, um solche Ga-Verunreinigungen an der Oberfläche und auch an den Schnittkanten der Lamellen zu verringern[365][366][367]. In den, in dieser Arbeit gezeigten Messungen an ZnO-Dünnschichten ist die Wahl dieses Schutzmaterials allerdings hinderlich.…”