“…The utilization of larger band-gap barrier materials will lead to a suppression of thermionic carrier leakage, which will, in turn, lead to a reduction in the temperature sensitivity of the threshold-current density of the lasers, in particular, at high-temperature operation. 15 The strain compensation of InGaAsN QW lasers using larger band-gap GaAsP tensile-strained barriers has been reported by Tansu et al 7,9,12,16 and W. Li et al 11 In general, wafers for InGaAsN lasers are grown either by molecular beam epitaxy (MBE) 4,5 or by metal-organic chemical vapor deposition (MOCVD). 2,9,10 Very high output power operations have been demonstrated in InGaAsN broad-area lasers grown by both MBE (ϳ4.2 W at a heatsink temperature of 10°C and with facet coating) 3 and MOCVD (1.8 W at a heatsink temperature of 20°C and with facet coating).…”