2019 Symposium on Design, Test, Integration &Amp; Packaging of MEMS and MOEMS (DTIP) 2019
DOI: 10.1109/dtip.2019.8752813
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Improved process for the manufacturing of back contact integrated cooling channels for concentrator solar cells

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Cited by 3 publications
(1 citation statement)
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“…Because of directly contacting with semiconductor chips, the heat transfer processes between chips and cooling systems will not be influenced by the thermal conductivities of encapsulation materials. Until now, researches on microfluidic cooling systems used in nonconcentration ground-mounted PV modules are very few and the corresponding research results are very preliminary [31]. In this work, we will investigate theoretically the improvement of the output parameters of an industrial c-Si SC by using a microfluidic cooling system.…”
Section: Introductionmentioning
confidence: 99%
“…Because of directly contacting with semiconductor chips, the heat transfer processes between chips and cooling systems will not be influenced by the thermal conductivities of encapsulation materials. Until now, researches on microfluidic cooling systems used in nonconcentration ground-mounted PV modules are very few and the corresponding research results are very preliminary [31]. In this work, we will investigate theoretically the improvement of the output parameters of an industrial c-Si SC by using a microfluidic cooling system.…”
Section: Introductionmentioning
confidence: 99%