Process and Measurement of Electroplated Back-Contact Integrated Microchannel Cooling Devices for CPV Cells

A Novel Approach for Cooling Chiplets in Heterogeneously Integrated 2.5-D Packages Applying Microchannel Heatsink Embedded in the Interposer

“…Dang et al [21] present the fabrication technology, assembly steps, and test results of a silicon chip with CMOS process compatible microchannel heatsink and thermofluidic chip input-output interconnect using wafer-level batch processing for 2-D and 3-D chips, as the microchannel heatsink is fabricated directly on the backside of each chip. One of the most interesting solutions can be the low-temperature electroplating process published in [22] and [23], where microchannels formed by electroplating were used for concentrated photovoltaic cell cooling.…”