2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530)
DOI: 10.1109/asmc.2004.1309559
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Improved process monitoring with Independent Components

Abstract: We propose a mefhod for process moniforing of a semiconductor manufacrrrriiig process. Independenf Component Analysis (ICA) is applied to characterize Etesf parameter data. We calculate angular confidence intervals for the model, eliminate marginally sign8cant components, and implement confrol cham for sign8canf componenfs of inreresf. Alarms are generated off of deviationr in the charted componenfs. Alarms are easily used in process diagnosis based on the interpretation of the independent components.

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Cited by 3 publications
(1 citation statement)
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“…Xia and Howell (2003) developed a spectral ICA approach to transform the process measurements from the time domain to the frequency domain and to identify major oscillations. Shannon et al (2003Shannon et al ( , 2004 used ICA in monitoring a semiconductor manufacturing process. They applied ICA on microelectronic parametric test (E-test) data to generate independent components for isolating the sources of variation in the test data.…”
Section: No Training Phasementioning
confidence: 99%
“…Xia and Howell (2003) developed a spectral ICA approach to transform the process measurements from the time domain to the frequency domain and to identify major oscillations. Shannon et al (2003Shannon et al ( , 2004 used ICA in monitoring a semiconductor manufacturing process. They applied ICA on microelectronic parametric test (E-test) data to generate independent components for isolating the sources of variation in the test data.…”
Section: No Training Phasementioning
confidence: 99%