2016
DOI: 10.1016/j.proeng.2016.11.503
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Improved Repeatability in Planar Water-gated Field Effect Transistor (WG-FET) with 16-nm-thick Single Crystalline Si Film

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Cited by 5 publications
(5 citation statements)
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“…The equation of the resistance is given as 1where Rw is the resistance of the DI-water droplet, is the resistivity of DI-water, d is the distance between Si layer and top gate and A is the area of the active Si layer and top gate surface. Simplified equations of the EDL capacitances can be given as (2) where C1 is the EDL capacitance on top gate surface, C2 is the EDL capacitance on Si layer surface, ε is the permittivity of DI-water and λ is the double layer thickness. When WG-FET is turned on, the voltage across its source and drain becomes approximately zero.…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…The equation of the resistance is given as 1where Rw is the resistance of the DI-water droplet, is the resistivity of DI-water, d is the distance between Si layer and top gate and A is the area of the active Si layer and top gate surface. Simplified equations of the EDL capacitances can be given as (2) where C1 is the EDL capacitance on top gate surface, C2 is the EDL capacitance on Si layer surface, ε is the permittivity of DI-water and λ is the double layer thickness. When WG-FET is turned on, the voltage across its source and drain becomes approximately zero.…”
Section: Methodsmentioning
confidence: 99%
“…Water-gated field effect transistors (WG-FET) that use 16-nm-thick single crystalline silicon film as active layer have a high potential in chemical and biological sensors because of their liquid-solid interfaces and capability to form integrated read-out circuit [1][2][3][4]. In WG-FET, EDL capacitance at water/silicon interface is used as gate insulator, which allows easy and low-cost fabrication of a low voltage device with high channel control.…”
Section: Introductionmentioning
confidence: 99%
“…After thermal annealing at 500 °C, ohmic contacts are obtained between Al and Si films. SiO2 in the field regions are insulated with photoresist (PR) for repeatability enhancement [3]. Source and drain electrodes are also insulated to prevent galvanic corrosion of Al in NaCl solution.…”
Section: Methodsmentioning
confidence: 99%
“…A thermal annealing process step is used to obtain ohmic contacts between source-drain electrodes and the active Si channel layer. All field region is insulated with 4 μm-thick photoresist (PR) layer to prevent charge trapping at the oxide surface and its parasitic effects [38,39]. Electrical contacts to source-drain electrodes are formed with silver epoxy and the…”
Section: Fabricationmentioning
confidence: 99%