Improved thermal conductivities in polystyrene nanocomposites by incorporating thermal reduced graphene oxide via electrospinning-hot press technique

Ruan, Kunpeng; Guo, Yue; Zhang, Yali; Zhang, Jiani; He, Mukun; Kong, Jie; Gu, Junwei

doi:10.1016/j.coco.2018.07.003

Cited by 126 publications

(42 citation statements)

References 50 publications

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“…As for filler, very interesting experiments are carried out with GE (graphene) and GNPs (graphene nanoplatelets) [25][26][27]. Graphene is technically a non-metal but is often referred to as a quasi-metal due to its properties being like that of a semi-conducting metal.…”

Section: Adhesives Used For Experimentsmentioning

confidence: 99%

Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly

Mach

Géczy

Polanský

et al. 2019

J Mater Sci: Mater Electron

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In our paper, the characterization of glass transition temperature (Tg) was performed for one-and two-component electrically conductive adhesive used in electronic joining technologies. Both adhesives were of the epoxy type with the silver filler. Dynamic mechanical analysis (DMA) was used to measure the Tg. The adhesives were modified with nanoparticles, namely, carbon nanotubes (concentration of 0.5 and 0.8% by weight) and silver nanoballs (2.5% by weight). The values of Tg were determined from the plot of the Tg δ parameter. Two types of environmental stresses were used for climatic aging: 125 °C/56% RH and 85 °C/85% RH. The aging of the samples at 125 °C and 56% RH caused increase Tg for all formulations. The cause of these changes is additional curing of adhesive. Aging in the combined climate 85 °C/85% RH caused a shift in Tg toward lower values for formulations based on the one-component adhesive modified by CNT and toward higher values for all other formulations. The major cause of the decrease in Tg was that CNT inhered the curing reactions and banned them from completion. In cases where Tg grew, glue hardening take place. DMA was performed to examine Tg of the samples. The DMA measurements were carried out up to 200 °C. Repeated DMA measurement confirmed that this measurement caused additional hardening and increase Tg for all samples. The results will contribute to the use of conductive adhesives with better quality and reliability in electronics manufacturing.

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Section: Adhesives Used For Experimentsmentioning

confidence: 99%

Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly

Mach

Géczy

Polanský

et al. 2019

J Mater Sci: Mater Electron

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“…Heat removal and heat management in microelectronics is now becoming important in light of the ever‐growing demand for miniaturization and development of wearable electronics . As a result, thermally conductive polymeric composite materials utilizing carbonous fillers such as reduced graphene oxide or inorganic fillers such as boron nitride (BN) have been investigated in a range of application including self‐healing resins, electronic packaging, ultra‐high voltage electrical devices, and energy storage field . Alternatively, electrospun polyethylene fibers and carbon fibers have also been investigated as thermally conductive substrates.…”

Section: Specific Heat Capacities At 30 °C and Densities Of Pu And Bmentioning

confidence: 99%

Processable Thermally Conductive Polyurethane Composite Fibers

Farajikhah

Amber

Sayyar

et al. 2018

Macro Materials & Eng

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In recent decades there has been a significant focus upon the incorporation of electronic components into textiles and wearable garments for functionalities such as sensing, health, environment monitoring, and energy storage. [1][2][3][4][5][6][7] Owing to the rapid development of nanoscience and technology, it is now possible to build electronic functions inside of, or on the surface of, fibers and consequently incorporate them into a garment structure using well-established textile fabrication techniques. [1] As a result of the ever-increasing demand for wearable electronics, research has focused on the development of electrically conductive fibers for applications including strain sensing, energy storage, and electrical wiring. [8][9][10][11][12] Heat removal and heat management in microelectronics is now becoming important in light of the ever-growing demand for miniaturization and development of wearable electronics. [13] As a result, thermally conductive polymeric composite materials utilizing carbonous fillers such as reduced graphene oxide [14] or inorganic fillers such as boron nitride (BN) [15][16][17][18][19] have been investigated in a range of application including self-healing resins, electronic packaging, ultrahigh voltage electrical devices, and energy storage field. [14,[16][17][18][19][20] Alternatively, electrospun polyethylene fibers [21] and carbon fibers [22] have also been investigated as thermally conductive substrates.In this study, processable thermally conductive composite fibers have been produced utilizing a solvent-based polymerfiller solution mixing method from which fibers were produced via a wet-spinning (solvent/non-solvent) technique. [23] Non-cross-linked polyurethane (PU) was selected as it exhibits similar mechanical properties to that of rubber, whilst being thermally and solvent-processable. The combination of high elasticity along with high abrasion resistance makes PU very popular for a wide range of applications. [24] In addition, noncross-linked PU is readily soluble in organic solvents, from which composite structures with different fillers can be readily produced. [5,8,9,25] Boron nitride, also known as white graphite, is an isoelectronic with carbon and has a wide range of attractive properties such as high thermal conductivity, low coefficient of thermal expansion, high electrical resistivity over a wide temperature range, high temperature stability, high mechanical strength and hardness, and chemically and thermally stable Thermally Conductive FibersThe demand for wearable electronics has resulted in an increasing interest in the development of functional fibers, with a specific focus upon the development of electrically conductive fibers incorporable into garments. However, the production of thermally conductive fibers for heat dissipation has been largely neglected. Owing to the very rapid development of miniaturized wearable electronics, there is an increasing need for the development of thermally conductive fibers as heat sinks and thermal management processes....

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“…Solid die drawing technology is one of the convenient methods for molecular orientation of polymers in solid state. Compared with other orientation processes, such as free solid drawing and electrospinning, through solid die drawing process, not only high production rates and high orientation can be achieved without using complex processing apparatus, but thick section samples including tubes, tapes, etc. can also be produced .…”

Section: Introductionmentioning

confidence: 99%

Multiple shape memory behavior of highly oriented long‐chain‐branched poly(lactic acid) and its recovery mechanism

Zhao

et al. 2019

J Biomedical Materials Res

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The shape memory effect of highly oriented long‐chain‐branched poly(lactic acid) (LCB‐PLA) prepared through solid‐phase die drawing technology was studied by comparison with PLA. When the recovery temperature increased from 60°C to 120°C, for PLA, only one‐step recovery at about 80°C can be observed and the recovery ratio was below 21.5%, while, for LCB‐PLA, multiple recovery behavior with high recovery ratio of 78.8% can be achieved. For oriented PLA, the recovery curve of the final sample showed the same trend with that of sample suffering just free drawing; while for oriented LCB‐PLA, the recovery curve of the final sample showed the same trend with that of sample suffering just die drawing. After shape recovery, the mechanical properties of LCB‐PLA showed a linear downward trend with the recovery temperature. Together with amorphous phase, the oriented mesomorphic phase, which formed during solid die drawing, can act as switching domains. And thus, upon heating, the chain segment of amorphous phase relaxed at first and triggered the first macroscopical shape recovery, leading to the decrease of long period (Lac) and the thickness of the amorphous layer (La). Then, with further increasing temperature, the oriented mesomorphic phase gradually relaxed resulting subsequently multi‐shape recovery, and the Lac and the La further decreased. Therefore, by regulating the recovery temperature of oriented LCB‐PLA, the shape recovery ratio and mechanical strength can be controlled effectively, and thus the self‐reinforced and self‐fastening effect can be achieved simultaneously for PLA as bone fixation material. © 2019 Wiley Periodicals, Inc. J Biomed Mater Res Part A: 107A: 872–883, 2019.

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Improved thermal conductivities in polystyrene nanocomposites by incorporating thermal reduced graphene oxide via electrospinning-hot press technique

Cited by 126 publications

References 50 publications

Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly

Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly

Processable Thermally Conductive Polyurethane Composite Fibers

Multiple shape memory behavior of highly oriented long‐chain‐branched poly(lactic acid) and its recovery mechanism

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