Improvement of deposition uniformity in alloy electroforming for revolving parts

Yang, Jianming; Kim, Dong-Hyun; Zhu, Daiyin; Wang, Kun

doi:10.1016/j.ijmachtools.2007.10.006

Cited by 27 publications

(13 citation statements)

References 21 publications

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“…According to Faraday's law, the denser electric field lines and the more prominent current density would result in faster deposition and growth rate at the cathode. [ 28 ] Figure 5b shows the simulated profiles of the deposition layer at different deposition times. The change of cathode edge thickness is more significant than that of cathode's other regions at any deposition time.…”

Section: Resultsmentioning

confidence: 99%

Simulation and Experiment of Localized Electrochemical Deposition with Re‐Entrant Structures by Applying the Tip Effect

Zou

Ren

et al. 2022

Adv Eng Mater

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Re‐entrant structures on the metallic surface play an essential role in the surface properties of materials. However, low efficiency in the preparation of such structures decreases their presence in different application areas. Herein, a new method of localized electrochemical deposition (LECD) manufacturing of re‐entrant structures by applying the tip effect (TE) is introduced. Thanks to this method, manufacturing complex re‐entrant structures can be realized rapidly and efficiently by a simple process without any external control. First, electrochemical measurement methods are used to analyze the copper electrodeposition mechanism, and then a simulation software is adopted to simulate this method. The simulation results suggest that the deposition velocity of the four edges on the copper microcolumn is faster than that of the other position, which means that applying TE makes it feasible to prepare re‐entrant structures by localized electrodeposition. Moreover, experimental results show that the deposition potential of −0.70 V and the deposition time of 900 s are the optimal parameter combinations to obtain the best re‐entrant structures. In addition, the volumetric deposition rate of a single re‐entrant structure can reach 924.8 μm3 s−1. This method provides an opportunity for large‐area manufacturing of re‐entrant structures and lays the foundation for future applications.

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Section: Resultsmentioning

confidence: 99%

Simulation and Experiment of Localized Electrochemical Deposition with Re‐Entrant Structures by Applying the Tip Effect

Zou

Ren

et al. 2022

Adv Eng Mater

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“…A complete model would provide how the system's electrochemical properties and the process parameters would affect the surface or mechanical property of the deposited material. Even though it has been reported that mechanical characteristics of electroformed parts [20] or tensile strength are influenced by current density [21] , as well as by increasing translational speed of moving mandrels [22], these aspects have yet to be incorporated into models. Although there is a recognition that additives can change deposit grain size and texture (and thereby mechanical properties) [23]- [44] there are no governing equations correlating them with deposit kinetics and growth.…”

Section: Materials Propertiesmentioning

confidence: 99%

Modelling the electroforming process: significance and challenges

Andreou

Roy

2021

Transactions of the IMF

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Electrochemical forming (or electroforming), is gaining recognition as an additive and sustainable manufacturing process. Electroforming could shape part of the fourth industrial revolution through thoughtful and systematic modelling. For this to be useful, efficient simulation of the electroforming process in 4.0 era should be used as a tool to design, test and propose optimised processes. Emphasis should be put on building models that provide new information about the electrochemical systems under investigation or lay the groundwork for innovative applications and provide the industry with options to update obsolete process models currently in use. This will lead to a decrease in process waste, lower inventory needs, perhaps meet environmental regulations and optimise supply chains. In this review article, key studies on modelling electroforming processes are critically reviewed against this framework. The authors suggest some useful modelling approaches using commercial software.

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“…Consequently, a faster deposition process in the mentioned areas leads to increase in the current density simultaneously, the effect of deposition rate becomes more pronounced. The non‐uniform current distribution may significantly affect the alloy composition and microstructure, hence the properties of the deposited material …”

Section: Introductionmentioning

confidence: 99%

Numerical and Experimental Analysis of Copper Electroforming on an Aluminum Substrate as a Rotating Cone Electrode Cell

et al. 2019

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In this paper, the advantages of numerical simulation to improve the process of copper electroforming are demonstrated. In this regard, the finite element model of copper electroforming for a rotating cone electrode was first prepared and then, the effect of the key parameters, such as applied current density, solution conductivity, electrode spacing, and anode height, on the uniformity of the thickness was investigated. The model combines tertiary current distribution with Bulter–Volmer electrode kinetics and computational fluid dynamics at the turbulent condition. In order to validate the model, a cone‐shaped shell was produced by electroforming method in the laboratory. The obtained results illustrate that the tertiary current distribution model on the rotating cone cell cathode is accurate and efficient for the electroforming process simulation and it can be used for parametric studies. Moreover, the effect of the current density on the morphology and properties of the electroformed layer was investigated.

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Improvement of deposition uniformity in alloy electroforming for revolving parts

Cited by 27 publications

References 21 publications

Simulation and Experiment of Localized Electrochemical Deposition with Re‐Entrant Structures by Applying the Tip Effect

Simulation and Experiment of Localized Electrochemical Deposition with Re‐Entrant Structures by Applying the Tip Effect

Modelling the electroforming process: significance and challenges

Numerical and Experimental Analysis of Copper Electroforming on an Aluminum Substrate as a Rotating Cone Electrode Cell

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