Improvement of electrical insulating properties for defective metal/epoxy resin interface in power modules by micro-plasma jet

Zhu, Xiangqin; Guan, Xiuhan; Dai, Liming; Cui, Xinglei; Fan, Jiajie; Fang, Zhi

doi:10.1016/j.apsusc.2023.158064

Cited by 8 publications

(1 citation statement)

References 41 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…They depict a higher value of Young's modulus than the criterion limit, which adds to the thermo-mechanical stresses the encapsulation material experiences. Therefore, many studies have been carried out to improve the thermal and mechanical properties of EP matrix [46] [47] [48], which will be discussed in detail later.…”

Section: Ieee Transactions On Dielectrics and Electrical Insulationmentioning

confidence: 99%

A Comprehensive Review of Mitigation Strategies to Address Insulation Challenges Within High-Voltage, High-Power-Density (U)WBG Power Module Packages

Adhikari,

Ghassemi

2024

IEEE Trans. Dielect. Electr. Insul.

View full text Add to dashboard Cite

Within the expanding domain of electrical power demand, the future of power module packaging is entwined with the progress of (ultra) wide bandgap (UWBG) materials. These materials, like silicon carbide (SiC), aluminum nitride (AlN), and diamond, offer advantages with higher power density, decreased weight, and expanded operational abilities regarding temperature, voltage, and frequency. However, the pursuit of pushing these limits confronts challenges within insulation systems, which may struggle to endure the demands of these parameters, potentially resulting in unfavorable conditions like high electric field, space charge accumulation, electrical treeing, and partial discharge (PD), leading to insulation failure. The emphasis of this paper is to review the insulation challenges within (U)WBG power modules and recent research in mitigating the electric field stress at triple points (TPs) and resolving the PD issues. The manuscript first discusses the high electric field stress issue at triple points. Then, ceramic substrate materials, encapsulation materials, and the influence of harsh weather conditions on them are reviewed. The space charge, electrical treeing, and PD issues within encapsulation materials are analyzed under practical operation conditions of (U)WBG power modules like high frequency, temperature, and square wave pulses. Finally, the various strategies to alleviate the associated insulation challenges are meticulously discussed. While the identified mitigation strategies are able to strengthen insulation systems for packaging, their validation under actual operational conditions of (U)WBG power modules remains relatively unexplored, representing a potential avenue for further investigation. This review offers a valuable framework by providing the constraints of the current studies and recommendations for the future that can be utilized as a reference point for future research endeavors. Index Terms-(U)WBG power module packaging, partial discharge, triple points, encapsulation material, electric field stress, high power density, field grading materials, nonlinear field-dependent conductivity layerThis paragraph of the first footnote will contain the date on which you submitted your paper for review, which is populated by IEEE.

show abstract

Section: Ieee Transactions On Dielectrics and Electrical Insulationmentioning

confidence: 99%

A Comprehensive Review of Mitigation Strategies to Address Insulation Challenges Within High-Voltage, High-Power-Density (U)WBG Power Module Packages

Adhikari,

Ghassemi

2024

IEEE Trans. Dielect. Electr. Insul.

View full text Add to dashboard Cite

show abstract

Construction of an organic iron phosphate/graphite carbon nitride hybrid system for improved fire safety of epoxy resin

Song,

Suo,

Rong

et al. 2024

Materials Today Sustainability

View full text Add to dashboard Cite

Simultaneously improving the comprehensive insulation performances of super-hydrophobicity, charge migration and surface flashover via atmospheric pressure plasma

Zhu,

Chu,

Guan

et al. 2024

Progress in Organic Coatings

View full text Add to dashboard Cite

Improvement of electrical insulating properties for defective metal/epoxy resin interface in power modules by micro-plasma jet

Cited by 8 publications

References 41 publications

A Comprehensive Review of Mitigation Strategies to Address Insulation Challenges Within High-Voltage, High-Power-Density (U)WBG Power Module Packages

A Comprehensive Review of Mitigation Strategies to Address Insulation Challenges Within High-Voltage, High-Power-Density (U)WBG Power Module Packages

Construction of an organic iron phosphate/graphite carbon nitride hybrid system for improved fire safety of epoxy resin

Simultaneously improving the comprehensive insulation performances of super-hydrophobicity, charge migration and surface flashover via atmospheric pressure plasma

Contact Info

Product

Resources

About