“…In order to improve the performance of devices fabricated on polysilicon, aluminium is being used to neutralise the defects that are present at the grain boundaries (GBs) in this material [ 1,2]. It has been reported that aluminium diffusion at 450 "C for 2 h increases the minority carrier diffusion length in polysilicon [3]. Rodot et al [4] report that, added as a dopant, aluminium can act as a trap or as a passivating agent in polysilicon.…”