Improvement of thermal conductivities for PPS dielectric nanocomposites via incorporating NH2-POSS functionalized nBN fillers

Yang, Xin; Tang, Lin; Guo, Yue; Liang, Chaobo; Zhang, Qiuyu; Kou, Kaichang; Gu, Junwei

doi:10.1016/j.compositesa.2017.06.005

Cited by 172 publications

(76 citation statements)

References 48 publications

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“…14). However, with the increasing addition of thermally conductive fillers, the corresponding λ values of the general polymeric composites are increased linearly [105], as shown in Fig. 15.…”

Section: Thermally Conductive Percolation Theorymentioning

confidence: 93%

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Yang

Liang

et al. 2018

Adv Compos Hybrid Mater

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302

124

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With the fast-developing miniaturization and integration of microelectronics packaging materials, ultrahigh-voltage electrical devices, light-emitting diodes (LEDs), and in areas which require good heat dissipation and low thermal expansion, the investigations on the polymeric composites with highly thermal conductivities and excellent thermal stabilities are urgently required, which would be beneficial to transferring the heat to the outside of the products, finally to effectively avoid substantial overheating and prolong their working life. Our article reviews recent progress in the classification, measurement methods, model and equations, mechanisms, commonly used thermally conductive fillers, and the correlative fabrication methods for the thermally conductive polymeric composites, aiming to understand and grasp how to enhance the λ value effectively. And future perspectives, focusing scientific problems and technical difficulties of the present thermally conductive polymeric composites are also described and evaluated.

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Section: Thermally Conductive Percolation Theorymentioning

confidence: 93%

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Yang

Liang

et al. 2018

Adv Compos Hybrid Mater

Self Cite

302

124

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“…21,25 For example, Gu et al fabricated polyhedral oligomeric silsesquioxane (POSS)-functionalized hBN. The as-made POSS-hBN was lled into bismaleimide/diallylbisphenol A 27 and polyphenylene sulde 28 to improve the thermal conductivity. Besides, designing a new polymer matrix is benecial for increasing the combination between hBN llers and the matrix.…”

Section: Introductionmentioning

confidence: 99%

Hot pressing-induced alignment of hexagonal boron nitride in SEBS elastomer for superior thermally conductive composites

Gong

Zhang

et al. 2018

RSC Adv.

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Styrene-ethylene-butylene-styrene (SEBS) composite films containing well-dispersed and highly aligned hexagonal boron nitride (hBN) platelets were achieved by a ball milling process followed by hot-pressing treatment. An ultrahigh in-plane thermal conductivity of 45 W m À1 K À1 was achievable in the SEBS composite film with 95 wt% hBN. The corresponding out-of-plane thermal conductivity was also as high. The hBN/SEBS composite film was further used to cool a CPU connected to a computer, resulting in a decrease by about 4 C in the stable temperature. Percolation thresholds over 40 wt% and 60 wt% in the hBN/SEBS composites were obtained in the in-plane and out-of-plane directions, respectively. This phenomenon has rarely been reported in polymer composites. Molecular dynamics simulations were also conducted to support this percolation threshold. The linear coefficients of the thermal expansion value of the hBN/SEBS composite with 95 wt% hBN was as low as 16 ppm K À1.This was a significant decrease compared to that of pure SEBS (149 ppm K À1). The proposed strategy provides valuable advice about the heat-transfer mechanism in polymer composites containing oriented two-dimensional materials.

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“…. For the GN sample, the first weight loss of 5% in the range 40150 °C is due to the release of water contained in GN . A second weight loss of 33% in the range 150800 °C was observed, which was attributed to the degradation of functional groups of epoxy and hydroxyl from the GN surface.…”

Section: Resultsmentioning

confidence: 95%

Intercalation structure and toughening mechanism of graphene/urea‐formaldehyde nanocomposites prepared via in situ polymerization

Liu

et al. 2018

Polymer International

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Based on the industrialized graphene (GN) product, a series of graphene/urea‐formaldehyde nanocomposites were synthesized via in situ polymerization by incorporation of silicon coupling agent with terminal amino groups (SA) as the compatibilizer. The results showed that addition of SA coupling agent led to much more efficient grafting of UF molecules on the GN surface with high layer thickness by formation of hydrogen bonding, and thus complete exfoliation and uniform dispersion of GN were achieved for the composites. Compared with neat UF, the addition of 1.0 wt% GN resulted in a roughly 25% increase in tensile strength and 12% increase in impact strength; meanwhile the impact fracture surfaces of the composite showed obvious ductile fracture characteristics, indicating the reinforcing and toughening effect of GN on the UF matrix. With increasing GN content, the storage modulus, glass transition temperature and crosslinking density of UF increased, while the tan δmax decreased, suggesting that a double crosslinking network structure with GN centered crosslinking point and chemical crosslinking point of UF molecular chains formed, leading to improvement in the stiffness of the composites. The present work showed promising potential for developing high performance UF resin on an industrial scale. © 2017 Society of Chemical Industry

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Improvement of thermal conductivities for PPS dielectric nanocomposites via incorporating NH2-POSS functionalized nBN fillers

Cited by 172 publications

References 48 publications

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Hot pressing-induced alignment of hexagonal boron nitride in SEBS elastomer for superior thermally conductive composites

Intercalation structure and toughening mechanism of graphene/urea‐formaldehyde nanocomposites prepared via in situ polymerization

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