Improvement of Thermal Environment by Thermoelectric Coolers and Numerical Optimization of Thermal Performance

Abstract

Seeking for an available thermal runaway solution is becoming one important and challenging issue in current nanometer ICs. Thermoelectric coolers (TECs) may give a solution. In this paper, a simplified power model of circuits closely associated with temperature with and without repeaters is derived. Based on the surface temperature difference and heat-flow density, an equivalent thermal resistance model for powered TECs is proposed. According to the thermal profile model, the steady-state temperature is calculated for the same chip with two different package forms. Finally, optimizations of p-n couples are performed with the purpose of obtaining the maximum coefficient of performance (COP) and minimum TECs power. As compared with the traditional flip-flop controlled-collapse-chip-connection package, the results reveal desirable conclusions that a 15.8% decrease of the chip stability temperature with the COP optimization at I = 2.5 A and 11.4% steady-state power savings with the 13.2 W TEC power consumption are obtained in a 50-nm technology node. Analysis demonstrates that the maximum COP and minimum power consumed by TECs can be obtained at different optimum numbers of p-n couples, which is independent of electrical current across by TECs.

Boolean Logic Computing Based on Neuromorphic Transistor

“…Ferroelectric materials have tunable and nonvolatile polarization characteristics, fast response, and long-term data retention capacity, so they are widely used in the construction of artificial neuromorphic transistors and have great advantages in nonvolatile logic gates and in-memory computing. [94][95][96] Luo et al use stacked unipolar MoS 2 and bipolar MoTe 2 as channel materials, and use P(VDF-TrFE) as the top and back ferroelectric gate dielectrics to prepare 2D ferroelectric gate field-effect transistor (FeFET) and realize the non-volatile logic gate function (Figure 6f). [97] The top and back ferroelectric gates are used as two logic inputs.…”

High Efficiency Thermoelectric Temperature Control System With Improved Proportional Integral Differential Algorithm Using Energy Feedback Technique

“…Electric energy can be converted into thermal energy by a thermoelectric cooler (TEC) based on the Peltier effect, which is generally used to cool large power devices and is applied to attain precise temperature control [14][15][16][17][18][19]. Due to the advantages of TEC over conventional cooling methods, including solid-state operation, absence of toxic residuals, scalability, maintenance-free operation, and long lifespan of reliable operation, TEC offers a great solution of temperature control as a semiconductor refrigeration device in many scenarios [20][21].…”