2012
DOI: 10.1016/j.msea.2012.01.081
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Improving mechanical properties of chip-based aluminum extrudates by integrated extrusion and equal channel angular pressing (iECAP)

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Cited by 109 publications
(88 citation statements)
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“…This process is dependent mainly on the shape and thickness of the chips. The compaction of the particles in the (semi) a pin are achieved varying bulk density of approximately 80% [4,6], it is according to the size of the pre-product and compacting pressure. Fig.3 displayed density change of chip billets during forward extrusion.…”
Section: Finite Element Modellingmentioning
confidence: 99%
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“…This process is dependent mainly on the shape and thickness of the chips. The compaction of the particles in the (semi) a pin are achieved varying bulk density of approximately 80% [4,6], it is according to the size of the pre-product and compacting pressure. Fig.3 displayed density change of chip billets during forward extrusion.…”
Section: Finite Element Modellingmentioning
confidence: 99%
“…The hot extrusion process can be used to direct conversion of aluminum chips to final products. Several papers [4][5][6] reported that direct extrusion with a lower ratio of 12:1 is not sufficient to establish a coherent / fixed connection between the chips. Due to the implementation of a new technologies operation, such as SPD (severe plastic deformation), into forward extrusion process.…”
Section: Introductionmentioning
confidence: 99%
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“…Lenka Nevertheless, uniformity of strain distribution across the cross-section of a processed material after a single ECAP pass can be relatively low [24]. By this reason, an ECAP pass can advantageously be combined either with subsequent passes, or with another SPD component to increase the efficiency and imposed strain uniformity [25,26]. Considering ECAP-based methods, the structure refinement is generally greater with a higher imposed strain.…”
Section: Introductionmentioning
confidence: 99%
“…The first stage of processing is therefore very important. The most widely-used methods for extruding of compacted chips are forward extrusion [17,18], extrusion through bridge dies [2,4,13], and new technologies, such as equal channel angular pressing (ECAP) [20][21][22][23] and friction stir wire extrusion [24].…”
Section: Introductionmentioning
confidence: 99%