Improving the adhesion of Au thin films onto poly(methyl methacrylate) substrates using spun-cast organic solvents

Mo, Alan; Devore, T. C.; Augustine, Brian H.; Zungu, Vezekile P.; Lee, Laura L.; Hughes, W. C.

doi:10.1116/1.3562167

Cited by 6 publications

(8 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Several studies indicate a large potential for increased Au-PMMA bonding and hence improved TBC through post-treatment of the as-deposited PMMA. Common methods are functionalizing the PMMA surface by plasma treatment [56], UV ozone surface modification [27], organic or halogenated solvents [57,58] and silane bridging [59]. The idea is to treat the PMMA such that chemical bonds can form at the Au-polymer interface.…”

Section: Resultsmentioning

confidence: 99%

Enhancement of Thermal Boundary Conductance of Metal–Polymer System

et al. 2020

View full text Add to dashboard Cite

In organic electronics, thermal management is a challenge, as most organic materials conduct heat poorly. As these devices become smaller, thermal transport is increasingly limited by organic–inorganic interfaces, for example that between a metal and a polymer. However, the mechanisms of heat transport at these interfaces are not well understood. In this work, we compare three types of metal–polymer interfaces. Polymethyl methacrylate (PMMA) films of different thicknesses (1–15 nm) were spin-coated on silicon substrates and covered with an 80 nm gold film either directly, or over an interface layer of 2 nm of an adhesion promoting metal—either titanium or nickel. We use the frequency-domain thermoreflectance (FDTR) technique to measure the effective thermal conductivity of the polymer film and then extract the metal–polymer thermal boundary conductance (TBC) with a thermal resistance circuit model. We found that the titanium layer increased the TBC by a factor of 2, from 59 × 106 W·m−2·K−1 to 115 × 106 W·m−2·K−1, while the nickel layer increased TBC to 139 × 106 W·m−2·K−1. These results shed light on possible strategies to improve heat transport in organic electronic systems.

show abstract

Section: Resultsmentioning

confidence: 99%

Enhancement of Thermal Boundary Conductance of Metal–Polymer System

et al. 2020

View full text Add to dashboard Cite

show abstract

“…Similarly, the fraction of Ti/Au remaining for the virgin plates was 9.5%, and it was improved to 96.0%. The adhesion of Ti/Au films is enhanced by a factor of 10, which significantly surpasses the adhesion for an oxygen plasma treated sample (26.3%) . Besides, even without the Ti adhesion layer, the fraction of Au remaining on the UV-ozone modified PMMA plate was also up to 89.9%, which is comparable to the result reported by spin-casting organic solvents (89.6%) .…”

Section: Resultsmentioning

confidence: 46%

“…Referring to the method of Augustine’s group, , a tape test adhesion measurement modified from the ASTM D3359-09 method was used to measure the adhesion of metal films on PMMA substrates. The representative micrographs of PMMA plates containing an 11 × 11 square array of circular metal dots before and after the tape test were shown in Figure S1.…”

Section: Resultsmentioning

confidence: 99%

“…However, it typically takes a few hours to finish all the preparation work such as loading the PMMA plate and vacuuming the process chamber before depositing metal films. Therefore, it was believed that the short-lived hydrophilicity was the main reason why the oxygen plasma treatment had very limited effectiveness in increasing the metal adhesion. , …”

Section: Resultsmentioning

confidence: 99%

“…However, since the polymer surface is nonpolar and has a low wettability, the adhesion of deposited metal films on polymer substrates is normally poor. , This is especially evident for weakly reactive metals, such as Cu, Ag, Au, or Pt . Several methods have been explored to modify the polymer surface to enhance the adhesion, such as plasma treatment using different gases, − irradiation with ion beam or excimer laser, and spin-casting organic solvents. , By these methods, some new polar groups are formed at the polymer surface, and the wettability is increased. Meanwhile, the polymer surface roughness is increased by a few of the aforementioned methods such as plasma treatment, which increases the surface area and also contributes to the improvement in the adhesion …”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Significant Enhancement of the Adhesion between Metal Films and Polymer Substrates by UV–Ozone Surface Modification in Nanoscale

Liu

Wang

et al. 2016

ACS Appl. Mater. Interfaces

View full text Add to dashboard Cite

Polymer metallization is extensively used in a variety of micro- and nanosystem technologies. However, the deposited metal film exhibits poor adhesion to polymer substrates, which may cause difficulties in many applications. In this work, ultraviolet (UV)-ozone surface modification is for the first time put forward to enhance the adhesion between metal films and polymer substrates. The adhesion of sputtered Cu films on UV-ozone modified poly(methyl methacrylate) (PMMA) substrates is enhanced by a factor of 6, and that of Au films is improved by a factor of 10. Moreover, metal films on the modified PMMA substrates can withstand a long-time liquid immersion. To understand the mechanism for the adhesion enhancement, the surface modification is studied with contact angle measurements, attenuated total reflection Fourier-transform infrared spectrometry (ATR-FTIR) and atomic force microscopy (AFM). Detailed characterization results indicate that the significant adhesion enhancement is attributed to the increases of both the surface wettability by generating some polar functional groups and the roughness of the surface in nanoscale. To demonstrate this novel polymer metallization method, a 6-in. PMMA chip with arrays of three-electrode electrochemical microsensors is designed and fabricated, and the microsensor exhibits excellent reproducibility, uniformity, and long-term stability.

show abstract

Understanding the Mechanism of Solvent‐Mediated Adhesion of Vacuum Deposited Au and Pt Thin Films onto PMMA Substrates

Brown

Rugg

et al. 2012

Adv Funct Materials

Self Cite

View full text Add to dashboard Cite

The adhesion of vapor deposited Au and Pt thin fi lms onto poly(methyl methacrylate) (PMMA) substrates can be signifi cantly enhanced by either spin-casting or vapor-exposure to hydrohalocarbon solvents prior to metal deposition. X-ray photoelectron spectroscopy (XPS) and evolved gas analysis Fourier transform infrared spectroscopy detect residual halogenated solvent at the PMMA surface which chemically activates the surface. Density functional theory (DFT) calculations show that the solvent molecules form a Lewis acid-base adduct with the ester oxygens in PMMA. DFT predicts that the deposited metal atom (M) inserts into the C-halogen (X) bond on either CHCl 3 or CHBr 3 to form a O-M-X interaction. This is consistent with M-X bonding observed in high resolution XPS. A model is proposed in which the bond energy of the C-X bond of the solvent must be weak enough so that it can be cleaved by the metal atom to form a M-X bond. A negative control of PMMA exposed to CHF 3 is shown to have no effect on Au or Pt adhesion since the bond dissociation energy of the C-F bond is stronger than the C-Cl and C-Br bond energy compared to the metal halide bond energies.

show abstract

Improving the adhesion of Au thin films onto poly(methyl methacrylate) substrates using spun-cast organic solvents

Cited by 6 publications

References 16 publications

Enhancement of Thermal Boundary Conductance of Metal–Polymer System

Enhancement of Thermal Boundary Conductance of Metal–Polymer System

Significant Enhancement of the Adhesion between Metal Films and Polymer Substrates by UV–Ozone Surface Modification in Nanoscale

Understanding the Mechanism of Solvent‐Mediated Adhesion of Vacuum Deposited Au and Pt Thin Films onto PMMA Substrates

Contact Info

Product

Resources

About