Improving the reliability of ball grid arrays under random vibration by optimization of module design

The application features of the Via-in-Pad method when implementing a high-density conductive pattern of multilayer switching structures in electronics is considered herein. The composition method for vias and contact pads for the tracing ability improvement is proposed, and the assessment methodology for the effective area utilization for BGA components is presented. The experimental study of the pressure sensor housing was carried out, which showed that the application of this method made it possible to reduce the number of vias by 40% and place more contact pads per unit area, which frees up the gaps for BGA tracing, reduces the pattern density and microwave signal paths. The obtained results confirmed the possibility of reduction of the usable space by 25%, which makes it possible to arrange more pads per unit area, to free up the gaps for BGA tracing, to reduce the time for drilling the workpieces, to reduce the number of used drills, and also provides the best heat removal from the components. The disadvantage is the large internal resistance of the transitions created by the Via-in-Pad method, in contrast to the standard ones, which can negatively affect the flow of critical signals. By comparing the resistances from the metallization layer of the via in the MPCB with a flexible flat cable and in the MPCB designed using the Via-in-Pad method, it was found that the Via-in-Pad method made it possible to increase the layout efficiency of multilayer printed circuit boards.

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“…Based on the conducted review, the authors offer new possibilities for using the Via-in-Pad method, which will solve the above problems [7].…”

Section: Methodsmentioning

confidence: 99%

Use of the “Via-In-Pad” Method to Ensure the High-Density Layout of the Conductive Pattern when Designing Multilayer Switching Structures

Chernov¹,

Kondakov²,

Perederin³

et al. 2020

Int. J. Adv. Sci. Eng. Inf. Technol.

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“…Density functional theory (DFT) along with the local density approximation as implemented in the SIESTA code to calculate electronic bandstructure [51][52][53][54][55]. A cut of energy equals to 400 Ry and Monkhorst-pack grid of 18 × 18 × 1 k-points was used.…”

Section: Computational Detailsmentioning

confidence: 99%

Anti-reflective MX (M = Sc and Y; X = N, P, As, Sb and Bi) monolayers: structural, electronic and optical study

Babaee Touski,

Hosseini,

Kokabi

2023

Semicond. Sci. Technol.

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In this paper, the structural, electronic and optical properties of tetragonal binary monolayers of MX (M = Sc, Y; X = As, Bi, N, P, Sb) are investigated using the density functional theory. The optical study demonstrates that ScN and YN compounds are promising anti-reflective materials. All compounds are found to be semiconductors with a bandgap in the range of 0.45–1.8 eV. Among these compounds, ScN and YN have a direct bandgap at Γ-point while the remainings demonstrate an indirect bandgap. It is found that the structural anisotropy controls the anisotropy of the electronic properties. The biaxial strain analysis shows that YBi monolayer has the maximum linear strain bandgap dependency, making it a suitable candidate for pressure sensing applications. The ScN and YN monolayers demonstrate a phase transition from semiconductive to Dirac semi-metallic characteristics at large compressive strains.

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“…Regarding the electronic assembly structure, it consists of various parts including silicon chips, packaging, copper pads, printed circuit boards (PCBs) etc. (Samavatian et al, 2018;Kokabi et al, 2018;Nourani and Spelt, 2015). These all exhibit diverse coefficients of thermal expansion integrating to each other using solders (Saad et al, 2018).…”

Section: Introductionmentioning

confidence: 99%

Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies

Olenev

Закиева

Smirnova³

et al. 2021

SSMT

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Purpose This study aims to present a more accurate lifetime prediction model considering solder chemical composition. Design/methodology/approach Thermal cycling and standard creep tests as well as finite element simulation were used. Findings The study found lower error in the solder joint lifetime evaluation. The higher the Ag content is, the higher the lifetime is achieved. Originality/value It is confirmed.

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Improving the reliability of ball grid arrays under random vibration by optimization of module design

Cited by 13 publications

References 18 publications

Use of the “Via-In-Pad” Method to Ensure the High-Density Layout of the Conductive Pattern when Designing Multilayer Switching Structures

Use of the “Via-In-Pad” Method to Ensure the High-Density Layout of the Conductive Pattern when Designing Multilayer Switching Structures

Anti-reflective MX (M = Sc and Y; X = N, P, As, Sb and Bi) monolayers: structural, electronic and optical study

Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies

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