2018
DOI: 10.1016/j.tsf.2018.07.031
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In house designed magnetron sputtering source: Effect of power and annealing on structural, optical and magnetic properties of NiFe2−Lu O4 (x = 0, 0.075) thin films

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Cited by 5 publications
(5 citation statements)
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“…The low power resulted in a low density due to the small sputtering yield [27]. By increasing the sputtering power, the Fe films densified, but excessive sputtering power led to coarse grains and uneven distribution, which resulted in high defects [43]. In order to further explain the effect of the sputtering power on Fe films, the particle size (Figure 6a) and size distribution (Figure 5g-l) must be In comparing the Ms of the Fe films deposited at different sputtering powers, it was observed that there is no obvious linear relationship between them.…”
Section: Magnetic Propertiesmentioning
confidence: 99%
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“…The low power resulted in a low density due to the small sputtering yield [27]. By increasing the sputtering power, the Fe films densified, but excessive sputtering power led to coarse grains and uneven distribution, which resulted in high defects [43]. In order to further explain the effect of the sputtering power on Fe films, the particle size (Figure 6a) and size distribution (Figure 5g-l) must be In comparing the Ms of the Fe films deposited at different sputtering powers, it was observed that there is no obvious linear relationship between them.…”
Section: Magnetic Propertiesmentioning
confidence: 99%
“…At the same time, Ms also had obvious advantages compared to the films prepared by other preparation methods, as shown in resulted in a low density due to the small sputtering yield [27]. By increasing the sputtering power, the Fe films densified, but excessive sputtering power led to coarse grains and uneven distribution, which resulted in high defects [43]. In order to further explain the effect of the sputtering power on Fe films, the particle size (Figure 6a) and size distribution (Figure 5g-l) must be mentioned again.…”
Section: Magnetic Propertiesmentioning
confidence: 99%
See 1 more Smart Citation
“…After purging the system with Ar gas, the discharge power was supplied to the target, initiating the formation of plasma. Since it is a magnetron sputtering system, a powerful magnetic field is generated using a strong magnet, one pole of which is placed along the central axis of the target and the other in the form of a ring along the edges of the target to confine the secondary electron motion around the target [ 15 ]. These constrained electrons attract a greater number of inert gas ions to be attracted towards the target at a higher kinetic energy, thereby resulting in an increased rate of ion (Ar + ) bombardments with the target, in turn ejecting a greater number of Au atoms [ 16 ].…”
Section: Methodsmentioning
confidence: 99%
“…For further exploration, RF sputtering was employed to apply films of Ni0.2Cu0.2Zn0.6Fe2O4 onto Si substrates. Typically, growth-related parameters, including substrate temperature, pressure during sputtering, gas type, and sputtering power, have been acknowledged as influential factors in magnetic property modulation [23][24][25][26][27].…”
Section: Introductionmentioning
confidence: 99%