Downstream high dose implant photoresist strip (HDIS) plasma processes tend to cause an oxide growth on the exposed poly Si and a poly-Si loss, both need to be carefully controlled/minimized to avoid undesirable impacts to the corresponding IC device performance. Ellipsometry and FTIR spectrometry were used to characterize the ultrathin film growth and poly-Si loss introduced by the various chemistries used in HDIS, including O2, O2/FG, O2/H2, and N2/H2. Some discrepancies were observed between results obtained from Ellipsometry and those from FTIR for ultra thin films. Oxide growth was evident in O2 dominant chemistries, accompanied by a low level poly-Si loss. No oxide growth was observed in non-O2 chemistries. Hydrogen addition provided a better clean and a shorter processing time, but at the cost of increasing poly-Si loss and oxide growth.