Atomic layer deposition (ALD) of Al 2 O 3 using trimethylaluminum (TMA) and H 2 O is the most widely and deeply studied ALD process owing to the superior properties of the deposited Al 2 O 3 thin films and usability of TMA and H 2 O. However, H 2 O can cause undesirable substrate oxidation during ALD. While previous studies have shown that alcohol oxidants can be used to deposit Al 2 O 3 thin films with less substrate oxidation, the reaction mechanism of ALD Al 2 O 3 with alcohol oxidants has not been elucidated yet. In this study, the reaction mechanism of ALD of Al 2 O 3 thin films using various alcohol oxidants was systematically investigated by computational and experimental methods. Various possible reaction pathways are considered for the oxidation of Al−CH 3 with methanol (MeOH), ethanol (EtOH), and propanol (n-PrOH). It is found that the feasible reaction mechanism for removal of the surface-adsorbed alkoxy group is autocatalytic liberation of alkene through β-hydrogen transfer. ALD processes were developed using the alcohol oxidants. Our process using EtOH showed a growth rate of 0.96 Å/cycle and a moderate level of carbon impurities (2.6%). In addition, we investigated the properties of ALD-deposited Al 2 O 3 thin films with alcohol oxidants, which indicated superior electrical properties and decreased formation of interfacial oxide on the Si substrate.