We report structural and kinetic studies of the
reactions of hydride species in Si thin films with atomic
deuterium
(Dat). Infrared (IR) spectroscopy is used to obtain
Si−H bonding information, and direct recoiling methods
are used to measure reaction rates. Two kinds of films are
prepared by filament-assisted growth from
Si2H6
and are characterized by IR spectroscopy. A film containing only
monohydride hydrogen is grown at 200
°C, and a polymer containing tri-, di-, and monohydride is grown at
−110 °C. Rates of H abstraction by
Dat,
and of Dat insertion into Si−Si bonds, are reported.
The abstraction rate of H by Dat in both films is
similar
to the abstraction rate on H-terminated crystal Si surfaces. The
insertion rate into Si−Si bonds in both films
is about one-tenth the rate of abstraction. A qualitative study of
the etching reaction of Dat with the polymeric
film is reported, and a strong temperature dependence is
observed.