2004
DOI: 10.1016/j.apsusc.2004.02.065
|View full text |Cite
|
Sign up to set email alerts
|

Preparation and properties of clean Si3N4 surfaces

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

2
32
0

Year Published

2006
2006
2024
2024

Publication Types

Select...
8

Relationship

0
8

Authors

Journals

citations
Cited by 43 publications
(34 citation statements)
references
References 78 publications
2
32
0
Order By: Relevance
“…23 Traditionally, many authors have used the Auger p-p ratio of Si LVV /N KLL as an indicator of SiN composition. [23][24][25][26] The detailed quantitative Auger depth profiling study of LPCVD and PECVD SiN films concluded that the p-p heights of the Si KLL and N KLL Auger transition in d N (E)/d E of the energy distribution is a reasonable indicator to determine SiN composition in Auger depth profiles over a wide range of atomic Si/N ratio. 23 It is generally agreed that the AES generally has excellent spatial resolution (15 nm), reasonable detection limit (<0.5 at%), good quantification with standards, and excellent speed.…”
Section: Resultsmentioning
confidence: 99%
“…23 Traditionally, many authors have used the Auger p-p ratio of Si LVV /N KLL as an indicator of SiN composition. [23][24][25][26] The detailed quantitative Auger depth profiling study of LPCVD and PECVD SiN films concluded that the p-p heights of the Si KLL and N KLL Auger transition in d N (E)/d E of the energy distribution is a reasonable indicator to determine SiN composition in Auger depth profiles over a wide range of atomic Si/N ratio. 23 It is generally agreed that the AES generally has excellent spatial resolution (15 nm), reasonable detection limit (<0.5 at%), good quantification with standards, and excellent speed.…”
Section: Resultsmentioning
confidence: 99%
“…Several heterogeneous techniques are used for SiN X thin film deposition, like low-pressure chemical vapor deposition (LPCVD) [1][2][3], plasma enhanced chemical vapor deposition (PECVD) [4][5][6][7], reactive evaporation [8], ion beam deposition [9,10] and reactive sputtering [11,12]. For such applications, PECVD is more suitable, since it yields good quality deposits at much lower temperature.…”
Section: Introductionmentioning
confidence: 99%
“…The SE parameters where fitted using a Cauchy dispersion law for the refractive index (n(λ) = A + B/λ 2 + C/λ 4 ), with A, B, and C being free parameters together with the total film thickness t. The obtained thickness values range from 155 to 164 ± 10 nm for the films deposited at 2.22 and 4.10 J/cm 2 respectively, in good agreement with the originally designed thickness. The refractive index in the infrared range (at 1500 nm) is around 2.17 ± 0.02 for both films, which is significantly higher than that reported for silicon nitride films [7]. For longer wavelengths it is found that the refractive index of the film deposited at higher energies showed a higher refractive index.…”
Section: Results and Discussion I) Compositional Analysismentioning
confidence: 81%
“…This is due to their excellent properties that include a large refractive index that can be tuned from that of SiO 2 (1.45) [6] to that of Si 3 N 4 (2.01) [7], high transparency in the visible-near infrared range, good electrical properties and compatibility with the current Si-technology. More recently, in the search for efficient light emitting materials with superior performance and large integration capability has motivated the study of more complex matrices such as aluminum-doped silicon oxynitrides.…”
Section: Introductionmentioning
confidence: 98%