2019
DOI: 10.1016/j.ijmecsci.2019.01.043
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In situ measurements and thermo-mechanical simulation of Ti–6Al–4V laser solid forming processes

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Cited by 78 publications
(34 citation statements)
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“…(2) [20] Thermal conductivity (N/(s mm 2 °C)) Eq. (3) [20] Emissivity 0.7 [26] 0.7 [27] Convection coefficient (N/(s mm °C)) 0.02 [28] 0.02 [29] Heat transfer coefficient (N/(s mm °C)) 5 [30] Initial workpiece temperature (°C) 930…”
Section: Parameters Workpiece Diesmentioning
confidence: 99%
“…(2) [20] Thermal conductivity (N/(s mm 2 °C)) Eq. (3) [20] Emissivity 0.7 [26] 0.7 [27] Convection coefficient (N/(s mm °C)) 0.02 [28] 0.02 [29] Heat transfer coefficient (N/(s mm °C)) 5 [30] Initial workpiece temperature (°C) 930…”
Section: Parameters Workpiece Diesmentioning
confidence: 99%
“…When the temperature of the material point falls lower than T anneal , the material can harden again. For instance, several authors [25,31,[53][54][55] exploited this approach in order to compute the stress field and perform a sensitivity analysis to this annealing temperature value. However, the sensitivity of the predicted displacement field was lower than that of the stress and it seemed not a key feature in the current validation.…”
Section: Thermophysical Propertiesmentioning
confidence: 99%
“…The temperature gradient between layers produces residual stresses and plastic deformations because the material cannot freely expand and contract. As a result, the accumulated 2 of 16 stresses generate warpage and, eventually, cracking in thin-walled structures, compromising both the geometrical accuracy and the structural integrity of the AM component [5][6][7][8].…”
Section: Introductionmentioning
confidence: 99%