Abstract:With ever-growing industry demand for more uniform and conductive metal or metal oxide thin film coatings, an improvement to the techniques that produce these materials must be done in parallel. Two techniques that have shown great utility in this regard are referred to as chemical vapour deposition (CVD) and atomic layer deposition (ALD). While both techniques offer highly modular reactor designs and robust precursorsubstrate chemistries (e.g., the benchmark Al 2 O 3 process), many processes result in nonunif… Show more
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