In-Situ Optical Creep Observation and Constitutive Modelling of Joint-Scale SAC Solder Shear Samples

Herkommer, D.; Reid, M.; Punch, Jeff

doi:10.1109/eptc.2008.4763484

Cited by 9 publications

(4 citation statements)

References 14 publications

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“…Although the Anand model is limited in its assumption that primary creep is negligible, in cases where steady-state strain is reached immediately it captures the development of creep well. In this study, the Anand model is used to describe the creep behavior of SAC105, in order to facilitate comparison against the behavior of SAC305, as reported in the body of work conducted by Herkommer et al (2008). …”

Section: Constitutive Modelsmentioning

confidence: 99%

“…The primary aim of this study is to investigate the creep performance of a low silver SAC alloy, Sn1.0Ag0.5Cu (SAC105). Previous work has been conducted at the authors' institution on the creep behavior and reliability of Sn3.0Ag0.5Cu (SAC305), as reported by Herkommer et al 2008. The subject of the current investigation is a SAC105 solder paste made with the same flux and elemental components as the SAC305, but with a lower silver content.…”

Section: Introductionmentioning

confidence: 96%

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Creep behavior of joint-scale Sn1.0Ag0.5Cu solder shear samples

Burke

Punch

Collins

2012

2012 IEEE 62nd Electronic Components and Technology Conference

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This study investigates the creep behavior of joint-scale Sn1.0Ag0.5Cu (SAC105) solder samples under shear loading. The objective of the work is to determine the Anand viscoplastic constitutive model parameters for this low silver content ternary SAC solder alloy. A series of monotonic constant shear stress (5 -15MPa) and constant shear strain rate (1E-6 -1E-2 (1/s)) tests was conducted at temperatures of 20ºC, 50ºC, 75ºC and 100ºC in order to provide data to extract the constitutive model parameters. The predictions of the Anand model are compared graphically with the experimental data in order to illustrate goodness-of-fit. SAC105 was found to be more creep resistant at higher strain rates than at lower strain rates for all temperatures and test conditions. The derived Anand parameters are shown to capture the creep performance of the SAC105 solder under shear loading very well, with the experimental data being tightly bound to the Anand predictions. In addition to the quantification of mechanical characteristics, a preliminary Electron Backscatter Diffraction (EBSD) investigation was conducted to investigate the effect of preconditioning on the grain structure of SAC105 solder joints. Results indicate that the misorientaion of the solder grains increased during preconditioning, signaling grain coarsening due to ageing.

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Section: Constitutive Modelsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 96%

Creep behavior of joint-scale Sn1.0Ag0.5Cu solder shear samples

Burke

Punch

Collins

2012

2012 IEEE 62nd Electronic Components and Technology Conference

Self Cite

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“…Table 2. For the time-dependent solder behavior the viscoplastic Anand-Model is used [15] with the parameters determined in [16] for SAC305 solder. The simulation results are evaluated using the surface operations method described earlier in [17].…”

Section: Finite Element Modeling Of the Solder Joint Behaviormentioning

confidence: 99%

Modeling solder joint fatigue in combined environmental reliability tests with concurrent vibration and thermal cycling

Eckert

Müller

Nissen

et al. 2009

2009 11th Electronics Packaging Technology Conference

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In this paper we discuss the lifetime prediction for Pb-free soldered flip chip components under combined temperature cycling (TC) and vibration loading in terms of the failure mechanisms related to solder joint fatigue. We show the results of several experiments including failure analysis and comparison of lifetime models. For this purpose Finite Element Analyses (FEA) of the thermal cycling and vibration load are carried out and the relevant damage parameters are extracted from these simulations. The results are used in the lifetime models to correlate experimental and predictive results. Shortcomings of the existing life prediction approaches are discussed and ways to improve lifetime prediction are suggested.

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“…In order to evaluate the reliability in an adequate way, accelerated tests are the most appropriate route. Although lots of efforts have been put in accelerated solder testing, there are still many challenges such as introduction of new types of solder materials, loading conditions, testing time, damage monitoring and failure identification [2][3][4][5][6]. Particularly the accelerated test of solder joints in applications with long expected lifetime like solder interconnects in solid state lighting products [7] is sometimes very time consuming and costly.…”

Section: Introductionmentioning

confidence: 99%

On the use of high precision electrical resistance measurement for analyzing the damage development during accelerated test of Pb-free solder interconnects

Zhang

Zwaag

Zeijl

et al. 2013

2013 IEEE 63rd Electronic Components and Technology Conference

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The reliability of solder interconnects in electronic packages is of vital importance. However, the demand for rapid product development puts an urgent need to develop new and fast testing methods and protocols for accurate crack initiation and propagation measurements for the new generation lead free solder. The failure is mainly due to two consecutive processes: viscoplastic deformation ultimately leading to crack initiation and crack propagation that leads to final catastrophic failure. This study shows the capability of high precision DC electrical resistance measurement to distinguish and in-situ monitor both mentioned processes occurred in individual solder joint. The experimental measurements are supported by both model calculations and additional experiments. The method developed offers potential to minimize testing time to considerable extent for new solder joints. A new test protocol for estimating the crack initiation time in a solder joint is proposed. The new test protocol is based on a widely used energy based solder joint fatigue model in which the conventional damage metric is replaced by electrical resistance increase rate.

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In-Situ Optical Creep Observation and Constitutive Modelling of Joint-Scale SAC Solder Shear Samples

Cited by 9 publications

References 14 publications

Creep behavior of joint-scale Sn1.0Ag0.5Cu solder shear samples

Creep behavior of joint-scale Sn1.0Ag0.5Cu solder shear samples

Modeling solder joint fatigue in combined environmental reliability tests with concurrent vibration and thermal cycling

On the use of high precision electrical resistance measurement for analyzing the damage development during accelerated test of Pb-free solder interconnects

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