Growth of an AlP epitaxial layer on the top of GaAs was proposed as a novel in situ passivation method. The AlP layer was almost converted to AlOx upon air exposure, forming a part of a gate dielectric. Removal of AlAs at the GaAs/AlP interface was mandatory for avoiding As-oxide formation upon air exposure, which necessitated complete As removal from the surface when switching growth from GaAs to AlP. H2S treatment allowed us to obtain low-As-content c(8×2) surface reconstruction for the first time with metalorganic vapor phase epitaxy (MOVPE). AlP on the c(8×2) GaAs surface has made it possible to obtain a smooth morphology and complete suppression of arsenic oxide. PL intensity increased by a factor of three with the AlP growth for 10 s at 500 °C, corresponding to a thickness of 0.5 nm. Accumulation capacitance obtained from capacitance–voltage (C–V) curves was the largest with that growth a condition of AlP, suggesting reduction in interface states.