2020
DOI: 10.1016/j.mtcomm.2020.100959
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In-Situ self-encapsulated flexible multi-layered poly (imide siloxane) copolymer film with resistance to atomic oxygen

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Cited by 4 publications
(3 citation statements)
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“…The mechanical properties of PI-A films are displayed in Figure , and all PI-A films exhibited excellent mechanical properties, with tensile strength ranging from 163 to 202 MPa, initial moduli ranging from 2.4 to 4.4 GPa, and elongations at break ranging from 8 to 12%. The tensile strength and initial modulus of PI-A films with low-level content of AHMA are superior to other PI and PI-based composite films , (Figure a). The introduction of AHMA units enhanced the flexibility of the molecular chains, leading to an increased elongation at break and a decreased initial modulus.…”
Section: Resultsmentioning
confidence: 93%
“…The mechanical properties of PI-A films are displayed in Figure , and all PI-A films exhibited excellent mechanical properties, with tensile strength ranging from 163 to 202 MPa, initial moduli ranging from 2.4 to 4.4 GPa, and elongations at break ranging from 8 to 12%. The tensile strength and initial modulus of PI-A films with low-level content of AHMA are superior to other PI and PI-based composite films , (Figure a). The introduction of AHMA units enhanced the flexibility of the molecular chains, leading to an increased elongation at break and a decreased initial modulus.…”
Section: Resultsmentioning
confidence: 93%
“…Properties of Silicon Methacrylates after UV Cure. Compounds 1 to 7 and selected stars and hyperbranched polymers (10,14,15,17) were formulated with photoinitiator (diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide, TPO) and UV-cured using a 395nm UV LED source to form transparent hardcoats. TPO was used at 2.5% for the monoand dimethacrylates and at 1% for the higher functional methacrylates.…”
Section: ■ Results and Discussionmentioning
confidence: 99%
“…It is well established in the literature that the presence of silicon in both inorganic layers (e.g., silicon itself, silicon dioxide, silicon oxynitride, silicon nitride) and in various organic polymer layers confers resistance to oxygen plasma. This results from the oxidation of surface silicon to nonvolatile SiO x species with long-range inorganic structures and glassy characteristics vs the oxidation of organics (C, H, O, N, F, Cl) to volatile small molecules more easily eroded from a surface and lost under vacuum conditions . Silicone-polyimide copolymers have been used in low earth orbit (LEO) space applications, exploiting the tendency of the silicone blocks to assemble at the surface and form a glassy protective layer in the presence of atomic oxygen. Polyhedral oligosilsesquioxanes (POSS) have also received attention in this area, because of their resistance to low earth orbit atomic oxygen, UV, protons and electrons. ,, In our own earlier work on inks for display devices, we built on these insights and used low viscosity hyperbranched polycarbosilane and polycarbosiloxane polymers as physical additives in UV-curable acrylate inks to confer oxygen plasma etch resistance . Contact angle measurements of cured inks with and without additives, taken before and after etching, suggested that additive was present at the polymer–air interface after coating and cure, and after plasma treatment, a more hydrophilic silica-like layer formed (exhibiting lower contact angle and greater hydrophilicity than the same sample before plasma treatment).…”
Section: Introductionmentioning
confidence: 99%