In-situ synergistic effect of Pr and Al2O3 nanoparticles on enhancing thermal cycling reliability of Sn-0.3Ag-0.7Cu/Cu solder joint

Wu, Jie; Xue, Songbai; Huang, Guoqiang; Chi, Fengfeng; Yang, Xiaolei; Xu, Yong

doi:10.1016/j.jallcom.2022.164152

Cited by 9 publications

(1 citation statement)

References 38 publications

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“…With cost saving Crystals 2022, 12, 1736 2 of 13 requirements, Ag content was decreased so that Sn proportion even reached around 99 wt.% [20]. In the low-Ag series, Sn-Ag-Cu solder with 1 wt.% Ag had a greater practical application potential when compared with Sn-Ag-Cu solder with 0.3 or 0.5 wt.% Ag, even after modified operation [21][22][23][24]. Even so, Sn-1 wt.% Ag-Cu low-Ag solder had a degradation in mechanical strength when compared to Sn-Ag-Cu eutectic solder.…”

Section: Introductionmentioning

confidence: 99%

Applicability Evaluation of Nano-Al2O3 Modified Sn-Ag-Cu Solder in High-Density Electronic Packaging Subjected to Thermal Cycling

Huang²,

et al. 2022

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Recently, 3D packaging has been regarded as an important technical means to continue Moore’s Law. However, excessive stacking will increase the longitudinal dimension, and one chip with high-density bondings packaging is still needed. Thus, it naturally places higher demand on thermal cycling reliability due to the decreased joint size to satisfy high-density packaging. In this work, the nano-Al2O3 (1 wt.%) modified Sn-1 wt.% Ag-0.5 wt.% Cu low-Ag solder was applied as a solder sample to evaluate the associated thermal cycling reliability. The investigated results revealed that the nano-Al2O3 modified solder did present enhanced thermal cycling reliability, as evidenced by the delayed microstructure coarsening and the inhibited atom inter-diffusion at interface caused by the adsorption of nano-Al2O3 on grain surfaces, and the resultant pinning effect. Worthy of note is that the potential of the newly developed nano-Al2O3 modified solder for high-density packaging applications (e.g., BGA, QFN, and CCGA) was evaluated based on the Finite Element Modeling.

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