In-situ temperature-dependent characterization of copper through glass via (TGV)

Pan, Ke; Xu, Jiefeng; Lai, Yangyang; Park, Seungbae; Okoro, Chukwudi; Joshi, Dhananjay; Pollard, Scott

doi:10.1016/j.microrel.2022.114487

Cited by 16 publications

(5 citation statements)

References 16 publications

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“…In a typical example, 2D-DIC is used to measure the surface thermal deformation of metal specimens. 18,19 In most cases, the heating device cannot be built together with the DIC measurement system. Therefore, the specimen can be heated to a certain temperature in the heating device and then placed back in the shooting position to record the deformation image (target image).…”

Section: Introductionmentioning

confidence: 99%

“…When 2D-DIC is used to measure the deformation of the specimen under a special load, the specimen must face the reposition problem in the ex-situ state before and after the load. In a typical example, 2D-DIC is used to measure the surface thermal deformation of metal specimens 18 , 19 . In most cases, the heating device cannot be built together with the DIC measurement system.…”

Section: Introductionmentioning

confidence: 99%

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Ex-situ deformation measurement system based on dual-reflector

Sun,

Ge,

et al. 2023

Opt. Eng.

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.We propose an ex-situ reposition error compensation method to solve the reposition error in the ex-situ state of 2D digital image correlation (2D-DIC) in the long-term deformation of the measurement specimen or under special load deformation. Using the dual-reflector auxiliary measurement system with an included angle of 90 deg, the two sides of the repositioned specimen are mapped into left and right mirrors. The in- and out-of-plane rigid body displacements are compensated via the error compensation method, and the real in-plane displacement of the tested specimen is obtained. The accuracy and practicability of this method are verified by conducting an in-plane rigid body displacement experiment, unloaded specimen reposition experiment, thermal deformation experiment, and finite element analysis. We provide a simple, effective, and high-precision deformation measurement method for 2D-DIC to realize ex-situ measurement.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Ex-situ deformation measurement system based on dual-reflector

Sun,

Ge,

et al. 2023

Opt. Eng.

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show abstract

“…In addition, the failure mechanism and optimization rule of TGV interposer architecture were systemically investigated [ 11 , 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 ]. Tensile radial and circumferential stresses were attributed to the origin of the circumferential cracks and the formation of radial cracks, respectively [ 11 , 13 , 14 ].…”

Section: Introductionmentioning

confidence: 99%

“…Tensile radial and circumferential stresses were attributed to the origin of the circumferential cracks and the formation of radial cracks, respectively [11,13,14]. Different annealing procedures were designed to study their influence on Cu protrusion mechanisms [12,15], and Cu protrusion was observed to saturate after a dwell time of 4 h with an annealing temperature of 400 • C. Irreversible Cu protrusion of Cu-filled TGV was generated after thermal cycling loading and is attributed to the plastic deformation and creep mechanism of Cu [16]. Different layout designs, such as fully filled via and conformal via, were demonstrated and investigated in terms of their thermomechanical reliability [17].…”

Section: Introductionmentioning

confidence: 99%

Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

et al. 2023

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The multi-chiplet technique is expected to be a promising solution to achieve high-density system integration with low power consumption and high usage ratio. This technique can be integrated with a glass interposer to accomplish a competitive low fabrication cost compared with the silicon-based interposer architecture. In this study, process-oriented stress simulation is performed by the element activation and deactivation technique in finite element analysis architecture. The submodeling technique is also utilized to mostly conquer the scale mismatch and difficulty in mesh gridding design. It is also used to analyze the thermomechanical responses of glass interposers with chiplet arrangements and capped epoxy molding compounds (EMC) during curing. A three-factor, three-level full factorial design is applied using the analysis of variance method to explore the significance of various structural design parameters for stress generation. Analytic results reveal that the maximum first principal stresses of 130.75 and 17.18 MPa are introduced on the sidewall of Cu-filled via and the bottom of the glass interposer, respectively. Moreover, the EMC thickness and through glass via pitch are the dominant factors in the adopted vehicle. They significantly influence the stress magnitude during heating and cooling.

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“…A specific failure of radial and circumferential cracks has been separately observed and attributed to the stress buildup during the heating and cooling process in the annealing heat treatment procedure [ 12 , 13 ]. The critical stress location of Cu-filled TGV has been explored as a Cu/glass interface because the mismatching of the aforementioned material CTE, the slower ramp rate, and the decent dwell time can help manage the thermal stress [ 14 , 15 ]. To reduce Cu protrusion-induced stress, a conformal-type TGV has been demonstrated, and a fully-filled TGV with considerable copper protrusion during thermal cycling was revealed [ 16 ].…”

Section: Introductionmentioning

confidence: 99%

Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach

et al. 2022

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In glass interposer architecture and its assembly process, the mechanical responses of interposer structure under thermocompression process-induced thermal loading and generated shrinkage of molding material are regarded as a major reliability issue. Thousands of metal-filled via are involved in glass interposers and are regarded as a potential risk that can lead to cracking and the failure of an entire vehicle. In this study, a finite element-based submodeling approach is demonstrated to overcome the complexity of modeling and the relevant convergence issue of interposer architecture. Convergence analysis results revealed that at least four via pitch-wide regions of a local simulation model were needed to obtain the stable results enabled by the submodeling simulation approach. The stress-generation mechanism during thermocompression, the coefficient of thermal expansion mismatch, and the curing process-induced shrinkage were separately investigated. The critical stress location was explored as the outer corner of the chip, and the maximum first principal stress during the thermocompression process generated on the chip and glass interposer were 34 and 120 MPa, respectively.

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In-situ temperature-dependent characterization of copper through glass via (TGV)

Cited by 16 publications

References 16 publications

Ex-situ deformation measurement system based on dual-reflector

Ex-situ deformation measurement system based on dual-reflector

Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach

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