Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach

Abstract

In glass interposer architecture and its assembly process, the mechanical responses of interposer structure under thermocompression process-induced thermal loading and generated shrinkage of molding material are regarded as a major reliability issue. Thousands of metal-filled via are involved in glass interposers and are regarded as a potential risk that can lead to cracking and the failure of an entire vehicle. In this study, a finite element-based submodeling approach is demonstrated to overcome the complexity of modeling and the relevant convergence issue of interposer architecture. Convergence analysis results revealed that at least four via pitch-wide regions of a local simulation model were needed to obtain the stable results enabled by the submodeling simulation approach. The stress-generation mechanism during thermocompression, the coefficient of thermal expansion mismatch, and the curing process-induced shrinkage were separately investigated. The critical stress location was explored as the outer corner of the chip, and the maximum first principal stress during the thermocompression process generated on the chip and glass interposer were 34 and 120 MPa, respectively.

Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

“…The glass interposer architecture utilized in this study comprises a 100 mm ×100 mm interposer and array-type Cu-filled TGV with a via diameter of 28 μm and a TGV pitch of 1 mm. Multi-chiplet arrangement design is further attached on the glass interposer, unlike the original vehicle utilized in the previous study [ 40 ]. As shown in Figure 7 , a one-quarter FEA model of an entire glass interposer vehicle is built in accordance with the symmetry of structure design.…”

“…The considered structural layout parameters of TGV, namely via diameter and via pitch, are defined as 28 µm and 1 mm, respectively, for the baseline design. The detailed fabrication process was demonstrated in the previous study [40]. The process steps are described Micromachines 2023, 14, 1506 4 of 15 as follows.…”

Improvement of catheter tip morphology by mold material used for tip‐forming process

“…Silva properties of molds required when performing molding processes using special materials, such as carbon fiber, epoxy, biodegradable components, and titanium alloys, and use them to optimize the molding process. [12][13][14][15] However, very few studies have attempted a scientific approach to minimize flash, which is a major problem in the tip-forming process, which is essential for catheter manufacturing.…”

“…Silva et al and Kanbur et al conducted a study to improve molding performance by optimizing the cooling channel in the mold, 9,10 and Kuo et al conducted a study to analyze the molding characteristics by changing the cooling channel as well as the cooling process and consider the productivity in injection molding 11 . In addition, Kipping et al, Major‐Gabryś et al, Wang et al, and Waalkes et al performed research to analyze the material, heat transfer, and rheological properties of molds required when performing molding processes using special materials, such as carbon fiber, epoxy, biodegradable components, and titanium alloys, and use them to optimize the molding process 12–15 . However, very few studies have attempted a scientific approach to minimize flash, which is a major problem in the tip‐forming process, which is essential for catheter manufacturing.…”

Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging

“…Figure 2 shows a schematic diagram of the structure during the decarrier process, where "Die" represents the chip, "Si THK" represents the stop layer (silicon nitride-a high dielectric constant material), "Passivation" represents the passivation layer, "Cu-pillar" represents the copper pillar, and "epoxy molding compound (EMC)" represents the epoxy molding compound. Many previous studies [1][2][3][4][5][6][7][8][9][10][11][12][13][14] have focused on evaluating whether changes in the structural design or material selection of the packaging can reduce the amount of wafer warpage caused by the thermal process in fan-out wafer-level packaging (FOWLP). Analyzing the effect of material properties on wafer warpage is one of the important ways of understanding warpage factors and effectively improving wafer warpage.…”