1989
DOI: 10.1063/1.101798
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Incidence angle effect of a hydrogen plasma beam for the cleaning of semiconductor surfaces

Abstract: Incidence angle effect of a hydrogen plasma beam with an ion energy of about 20 eV was observed in a cleaning process for GaAs and Si surfaces for the first time. An atomically flat (001) GaAs substrate surface which was observed by clear Laue spots was prepared with a glancing angle of incidence. Similar improvement of smoothness was observed with the glancing angle of incidence on a Si surface when it was compared with perpendicular incidence. The mechanism is discussed considering momentum transfer parallel… Show more

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Cited by 49 publications
(8 citation statements)
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“…[4][5][6][7] However, these sources are expensive and physically incompatible with standard MBE equipment. To remove contaminants from the GaAs substrate surface, ion-or plasma-beam etching and/or thermal etching is typically used.…”
Section: Gaas(001)mentioning
confidence: 99%
“…[4][5][6][7] However, these sources are expensive and physically incompatible with standard MBE equipment. To remove contaminants from the GaAs substrate surface, ion-or plasma-beam etching and/or thermal etching is typically used.…”
Section: Gaas(001)mentioning
confidence: 99%
“…RHEED was previously used to study surface cleaning of hydrogen-plasma treated GaAs and Si surfaces. 20 A surface with NEA is obtained when the vacuum level is lowered below the bulk conduction band minimum at the surface; thus, electrons excited to the conduction band minimum can be emitted from the surface. The escape depth in this case is not limited by the mean-free path of the hot electrons, which is on the order of 10 nm, but by the diffusion length of the electrons thermalized to the conduction band minimum, which is on the order of several m. 21 Achieving NEA requires the combination of electron affinity lowering and downward band bending, 22 and thus p-type doping is favored.…”
Section: Introductionmentioning
confidence: 99%
“…Normal incidence irradiation using a hydrogen plasma source produced more surface damage than grazing incidence irradiation. 25 In contrast, cracking sources produce atomic hydrogen with kinetic energies thermalized with the ambient gas. For InP, atomic hydrogen cleaning can be accomplished at a surface temperature ϳ350-400°C.…”
Section: Introductionmentioning
confidence: 99%