Incorporating Package Grinding Process for QFN Thin Device Manufacturing

Rodriguez, Rennier S.; Gomez, Frederick Ray I.

doi:10.9734/jerr/2019/v9i217014

Cited by 7 publications

(4 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Fig. 7 illustrates the assembly method discussed in [9], which is applicable for this augmented QFN leadframe design.…”

Section: Resultsmentioning

confidence: 99%

See 1 more Smart Citation

Semiconductor QFN Package with Advanced Interlocking Design

Rodriguez¹,

Gomez²

2020

JERR

View full text Add to dashboard Cite

The mechanical interlocking structure for quad-flat no-lead (QFN) assembly for densified leadframe degrades as the package becomes thinner. Detractors such as package reliability and design requirement hinder further qualification of leadframes with increased number of input/output (I/O) pins. In this paper, a new and advanced design of leadframe is discussed and presented with improvement in mechanical interlocking structure of high stress areas such as lead and pad junction. The leadframe is re-designed having lead lines on the lead and pad that will be etched away after molding process replacing full copper base frame. Through application of the design, the effective mechanical interlocking is improved from 60% to 100% for mold-lead and mold-pad interface.

show abstract

“…Fig. 7 illustrates the assembly method discussed in [9], which is applicable for this augmented QFN leadframe design.…”

Section: Resultsmentioning

confidence: 99%

“…Interlocking design parameters Assembly method Augmented QFN with advanced interlocking design Method of assembly[9] …”

mentioning

confidence: 99%

Semiconductor QFN Package with Advanced Interlocking Design

Rodriguez¹,

Gomez²

2020

JERR

View full text Add to dashboard Cite

show abstract

“…Brainstorming was done about the importance of sub-index checking known as the vertical indexing prior proceeding the lots for singulation, on top of the verification of first cut line alignment for horizontal indexing. Works and studies shared in [1][2][3][4][5][6][7] focused on the cutting method, design, and pattern recognition were helpful in this study. The authors have also studied about the existing assistance of shopfloor to adjust the hairline to catch up with the correct alignment.…”

Section: Methodsmentioning

confidence: 99%

Proactive Verification of Strip Y-Index to Mitigate Gross Misaligned Cut due to Mismatched Unit Pitching

Buera¹,

Mendoza²,

Gomez³

2021

JERR

Self Cite

View full text Add to dashboard Cite

Shopfloor practices that when the first cut line was aligned with the hairline, actual blade cut, and saw street of the strip, the succeeding cut lines will automatically follow with the same alignment. Considering various factors that affect the condition of the strip, it was recommended to verify the succeeding cut lines of the strip to project if the hairline will still be aligned with the saw street as cutting goes on. Unfortunately, verification of succeeding cut lines was usually skipped and refer only with the first cut alignment as reference. Thus, end up risking the units for possible cutting misalignment. Cutting misalignment can be encountered when the programmed unit pitching measurement was mismatched with the actual unit pitch of the strip. However, mismatching of the unit pitch can be anticipated through y-indexing where the saw street of the strip will be verified for alignment with the hairline along the succeeding cut lines. Frequent occurrence of mismatched unit pitching was brought about by the strip condition after series of assembly processes that expands and retracts the strip. With the mentioned scenario which has been encountered from different semiconductor assembly plants, it was best to verify the y-indexing of the strip on top of verification on the first cut line alignment. Application of y-indexing verification is essential for the entrapment and correction of mismatched unit pitching. Rejection of units due to misaligned cuts can also be prevented. Assistance of operators to adjust and monitor the hairline to compensate the actual pitching was also avoided as early as first cut line verification.

show abstract

“…The introduction of densified version of Quad-Flat No-lead (QFN) packaging became the interest of Integrated Circuit (IC) manufacturer [1] since it can be an alternative solution to the transition of Ball Grid Array (BGA) devices to cheaper packaging like QFN which is anticipated…”

Section: Introductionmentioning

confidence: 99%

Implementation of Pads Re-layout for QFN Multi-row Breakthrough

Rodriguez¹,

Gomez²,

Maming³

2020

JERR

View full text Add to dashboard Cite

An alternative design of Quad-Flat No-lead (QFN) leadframe capable with three or more arrays of lead is discussed and presented on this paper. The leadframe design is integrated with connecting bars that can be routed and bonded with wires to decrease the wire span and create a more manufacturable wirebonding structure in densified design of QFN. In addition, the connecting bars produced an inter-connection link between relocated pads and extended input/output (I/O) leads for the 3rd array electrical connections. The implementation of the proposed augmented design would improve the manufacturability of multiple arrays of I/O in QFN, enabling cost-saving initiative and manufacturing solution to devices with multiple arrays requirement.

show abstract

Incorporating Package Grinding Process for QFN Thin Device Manufacturing

Cited by 7 publications

References 7 publications

Semiconductor QFN Package with Advanced Interlocking Design

Semiconductor QFN Package with Advanced Interlocking Design

Proactive Verification of Strip Y-Index to Mitigate Gross Misaligned Cut due to Mismatched Unit Pitching

Implementation of Pads Re-layout for QFN Multi-row Breakthrough

Contact Info

Product

Resources

About