Nowadays, electronic manufacturers trend are to become thinner and thinner especially those electronic gadgets that is very handy and convenient on our daily necessity. Challenge with the leading manufacturers is the production and development of less size gadget yet with richness of available application and uses that we can work on with what can please its consumer for their convenience and satisfaction. As with the semiconductor company, correlation between becoming thinner versus manufacturing capability become significantly opposite, as the package become thinner the more complex its related process can be. This study covers innovative approach in die attach station on critical handling of thin die packages. Lessons and learning were documented from Ball Grid Array (BGA) packages as first to be evaluated with thin package requirements.  Also discussed herewith are documented defects and related issues during trials and die attach builds that has been a show stopper on its early production.

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The need of data storage devices and new technologies continues to grow with more robust and stable functioning capability. With that, improvement and utilization never stop for a seamless output. One device that is currently on new product introduction is a quad-flat no-leads (QFN) utilizing a tapeless leadframe technology. The new device used highly conductive glue with metal spacer and has experienced gross glue voids defect parts per million (ppm). Glue voids were measured for cumulative voids criteria, with values higher compared to the specification. The study used analysis of variance (ANOVA) on the dispense needle diameter and revealed the effect levels of needle diameter on cumulative voids reduction. For subsequent works, the configuration could be applied for packages with similar requirement.

Package thinning, down-scaling, and miniaturization are common interests among semiconductor industries, with each manufacturing site having different approach and technical directions in providing novelties in their products. The paper offers an innovative design of manufacturing flow to reduce the semiconductor package height of a Quad-Flat No-leads (QFN) device through the application of a specialized package grinding process.  The process would significantly reduce the carrier thickness for the overall package height configuration of QFN. Through this integration, the common assembly barriers and defects related in producing thin devices are eliminated, thus thinner version manufacturing becomes more simplified and efficient.

The paper focused on the elimination of die crack occurrence at the diebond process. Design of experiment (DOE) was done on the pick and place rubber-tip design and an improved design was finalized. The improved rubber-tip configuration with smaller vacuum design and full contact surface eventually resolved the die crack issues, improving the manufacturability of thin silicon die during diebond process. For future works, the configuration could be applied for packages with similar requirement.