Process Optimization Study on Leadframe Surface Enhancements for Delamination Mitigation

Buenviaje, Salvador C.; Rodriguez, Rennier S.; Seguido, Rammil A.; Gomez, Frederick Ray I.

doi:10.1109/eptc50525.2020.9315025

Cited by 11 publications

(5 citation statements)

References 13 publications

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“…For succeeding works and studies, this design could be used to process other devices with similar configuration or requirement. Moreover, studies and learnings shared in [6][7][8][9][10] are helpful to improve the die attach process.…”

Section: Discussionmentioning

confidence: 99%

Substrate Design Augmentation for Die Placement Reference at Die Attach Process

Rodriguez¹,

Graycochea²,

Gomez³

2021

JERR

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Die placement reference in die attach process is one of the critical aspects in measuring the actual die placement especially for the device that has a required measurement. This paper focused on the re-design on the layout of the substrate ball grid array (BGA) package with cross fiducials at the singulation lane which are located at the corner portions of the device. The cross fiducial would serve as a reference when measuring the actual placement of the Silicon die in the package. With this improvement, the technicians and operators could now easily identify the reference based on the mount and bonding diagram requirement.

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Section: Discussionmentioning

confidence: 99%

Substrate Design Augmentation for Die Placement Reference at Die Attach Process

Rodriguez¹,

Graycochea²,

Gomez³

2021

JERR

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show abstract

“…Future works could use the new die design to realize a robust die attach process and prevent any die attach related assembly issues. For references, works shared in [1][2][3][4][5] are helpful in tackling delamination issues. Studies and learnings discussed in [6][7][8][9][10][11][12] are useful to address other die attach related challenges.…”

Section: Discussionmentioning

confidence: 99%

Silicon Die with Integrated Epoxy for Improved Interface Adhesion

Gomez¹,

Rodriguez²

2021

JERR

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Breakthroughs and innovations are constantly being developed in electronic packaging industry to address the manufacturing challenges and overcome existing assembly limitations. An augmented design of thin Silicon die is introduced to establish a robust and improved interface adhesion between the die and the die attach material during the die attach process. The wafer preparation flow is also presented. The realization of the augmented die design with integrated epoxy material would ultimately provide a robust connection and would mitigate the die attach related issues such delamination, die cracks and voids.

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“…Learnings from this manuscript combined with other ideas mentioned in the literature and in [8][9][10][11][12] would help reinforce and promote a lean and robust manufacturing on all branches of industry.…”

Section: Conclusion and Recommenda-tionsmentioning

confidence: 90%

Digital Exhaust Controller for Pressure Detection on Die Attach Oven Curing Machine

Rosa¹,

Dinglasan²,

Gomez³

2021

JERR

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Innovation on die attach curing process on semiconductor industry play a big role to have a robust process eliminating unwanted gross unit rejection. Resolving failures and hardware breakdowns on the exhaust system of oven curing process are the focus of this paper. Discoloration and contamination due to outgas and fumes that cannot exit the oven chamber are the effects of a failed exhaust system. Addressing the said phenomenon showing simulations, trial runs will be discussed on this paper. Promoting an innovative approach that includes real time monitoring of the system performance, and detection of its failure to prevent continuous operation with failed exhaust system are performed to have an appropriate resolution.

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Process Optimization Study on Leadframe Surface Enhancements for Delamination Mitigation

Cited by 11 publications

References 13 publications

Substrate Design Augmentation for Die Placement Reference at Die Attach Process

Substrate Design Augmentation for Die Placement Reference at Die Attach Process

Silicon Die with Integrated Epoxy for Improved Interface Adhesion

Digital Exhaust Controller for Pressure Detection on Die Attach Oven Curing Machine

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